Double-sided etched steel mesh and its manufacturing process

Abstract

The invention relates to a double-face-etched steel mesh. The double-face-etched steel mesh comprises a screen printing plate, wherein a plurality of mesh holes are etched in the screen printing plate; the thickness of each mesh hole is equivalent to that of the corresponding to-be-printed tin paste; the mesh holes comprise first mesh holes etched from the upper surface of the screen printing plate, second mesh holes corresponding to the first mesh holes and etched from the lower surface of the screen printing plate, and open pores connected with the first mesh holes and the second mesh holes. The manufacturing process for the double-face-etched steel mesh comprises the following steps of (1) etching the upper surface of the screen printing plate to form the first mesh holes; and (2) etching the lower surface of the screen printing plate to form the second mesh holes. By virtue of the double-face etching mode, the etching thickness of a single face of the steel mesh is reduced, so that overhigh tolerance in the etching process is avoided, and the etching precision of the steel mesh is improved, and the printing precision and product yield of the flexible type printed circuit board can be further improved.

Description

technical field [0001] The invention belongs to the printing field of flexible circuit boards (flexible printed circuit boards), and specifically relates to a high-precision steel mesh used in printing and a manufacturing process of the steel mesh. Background technique [0002] Affected by the development of the electronic industry towards the trend of highly integrated functions and miniaturized parts, the existing flexible printed circuit boards often encounter situations in which parts of various sizes and specifications must be mounted on the same surface during SMT production. It is required that when FPC prints solder paste, different solder paste printing thicknesses must be set according to the solder demand of different parts. [0003] At present, the traditional SMT stencils are designed in steps, and it is necessary to produce stencils with different thicknesses through a single-sided etching process, that is, to produce meshes 2 with the required thickness c on o...

AI Technical Summary

Problems solved by technology

At this stage, when the thickness of the stencil etched by the stencil manufacturer exceeds 0.1mm, the etching accuracy will be affected due to the concentration of the solution, etching time, temperature, etc., thereby affecting the printing accuracy of the required stencil. The greater the thickness of the single-sided etching , the larger the tolerance (when the etching thickness ≦ 0.06mm, the tolerance will be within 0.01mm, and the etching thickness exceeds 0.1mm, the tolerance will be within 0.03mm), which cannot meet the production accuracy requirements and affect the production yield

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