Preparation method for trapezoid pixel Bank structure and OLED device
A trapezoidal and pixel technology, which is applied in the manufacturing of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., can solve the problems of difficult surface hydrophilic and hydrophobic treatment of vertical pixel Bank structure, poor pixel uniformity of devices, and reduction of device aperture ratio, etc. Achieve the effect of reducing lateral erosion, avoiding device open circuits, and improving uniformity
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[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0036] combined with Figure 2-7 , the embodiment of the present invention provides a method for preparing a trapezoidal pixel Bank structure, comprising the following steps:
[0037] S01. Provide a TFT backplane, coat a layer of Bank material on the electrodes of the TFT backplane, and bake the Bank material to form a Bank layer with adhesion to the electrodes, wherein the Bank material is positive Bank material;
[0038] In the above step S01, in this embodiment, the TFT backplane includes a TFT array and electrodes sequentially stacked on a hard carrier substr...
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