Integrated cooling fin, manufacturing mold and manufacturing method for integrated cooling fin

A technology for manufacturing molds and heat sinks, applied in heat exchange equipment, lighting and heating equipment, laminated components, etc., can solve problems affecting heat transfer, low production efficiency, breakage, etc., to improve heat dissipation efficiency, increase production efficiency, The tight effect

Pending Publication Date: 2017-09-15
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, there are the following problems in the manual bonding of the soft thermal pad: the bonding degree is not strong enough, the production efficiency is low, and the manual bonding makes the contact gap between the soft thermal pad and the bot

Method used

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  • Integrated cooling fin, manufacturing mold and manufacturing method for integrated cooling fin
  • Integrated cooling fin, manufacturing mold and manufacturing method for integrated cooling fin
  • Integrated cooling fin, manufacturing mold and manufacturing method for integrated cooling fin

Examples

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Embodiment

[0023] An embodiment of the present invention provides an integrated heat sink, such as figure 1 As shown, it includes: a heat sink body 1 with heat dissipation fins 11 and a heat dissipation substrate 12 , and the bottom plane of the heat dissipation substrate 12 is integrally formed with a soft heat conduction pad 2 in a thermosetting manner.

[0024] In this embodiment, the soft heat conduction pad adopts heat conduction silica gel, of course, heat conduction silicone grease or heat conduction gel may also be used in other embodiments.

[0025] In order to make the combination of the soft thermal pad and the heat sink body more stable, the heat dissipation substrate can be made of thermal conductive resin or heat-resistant plastic.

[0026] In this embodiment, after the heat sink product is completed, the soft heat conduction pad is solidified in a thermosetting manner, so that after the heat sink product is completed, there is an integrally formed soft heat conduction pad....

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PUM

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Abstract

The invention discloses an integrated cooling fin, a manufacturing mold and a manufacturing method for the integrated cooling fin. The integrated cooling fin comprises a cooling fin main body; wherein the cooling fin main body is provided with cooling fin bodies and a cooling base plate; and a soft heat conduction pad is integrally formed in the plane of the bottom of the cooling base plate in a cured mode by adopting a thermosetting method. According to the integrated cooling fin, the manufacturing mold and the manufacturing method for the integrated cooling fin, a structure integrally formed by the soft heat conduction pad and the cooling fin main body is adopted so that the manual gluing procedure can be omitted, and therefore the production efficiency can be greatly improved, in terms of the integrated cooling fin, the soft heat conduction pad and the cooling fin main body can be combined more tightly, the heat conduction pad cannot be easily separated from the cooling fin main body, a heat transmission path can be free of gaps, the heat resistance can be reduced, and the cooling efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation products, in particular to an integrated heat sink, a manufacturing mold and a manufacturing method thereof. Background technique [0002] In order to achieve the effect of high heat conduction efficiency in close contact with the heat source when the existing heat sink is in use, a soft heat conduction pad is arranged between the bottom of the heat sink substrate of the heat sink and the heat source device. The addition of this soft heat conduction pad, Generally, the cut soft heat conduction pad is manually pasted on the bottom of the heat dissipation substrate of the heat sink, and then sealed with a protective film so that the soft heat conduction pad will not be damaged during storage and transportation. In fact, there are the following problems in the manual bonding of the soft thermal pad: the bonding degree is not strong enough, the production efficiency is low, and the manual bon...

Claims

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Application Information

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IPC IPC(8): F28F3/02B29C39/10B29C39/26
CPCF28F3/02B29C39/10B29C39/26
Inventor 谢佑南
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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