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Electronic device having heat radiation plate

A technology of electronic equipment and heat dissipation plate, which is applied in the direction of electrical equipment construction parts, circuits, inductors, etc., can solve the problems of current loss, wireless transmission efficiency reduction, etc., and achieve the effect of improving heat dissipation efficiency

Inactive Publication Date: 2017-09-19
WITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the case of using a general conductive heat dissipation member, eddy currents (Eddy Current) may be generated due to wireless transmission of electromagnetic waves, and current loss due to the eddy current may occur
[0005] Current loss caused by eddy currents may lead to extremely low efficiency of wireless transmission, or create new hot spots

Method used

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  • Electronic device having heat radiation plate
  • Electronic device having heat radiation plate
  • Electronic device having heat radiation plate

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Embodiment Construction

[0025] Before the invention is described in detail, the terms or phrases used in the specification and claims described below should not be limited to the usual or dictionary meanings, but should be based on the inventor's ability to use the most The best way to describe his invention is to properly define the concepts of terms, whereby the terms or phrases should be interpreted as meanings and concepts consistent with the technical idea of ​​the present invention. Therefore, the embodiments described in this specification and the structures shown in the accompanying drawings are only the most preferred embodiments of the present invention, and do not represent all technical ideas of the present invention. Therefore, according to the present application, there may be many alternatives that can replace them. Equivalents and modifications.

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings....

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Abstract

The present invention relates to an electronic device with a heat radiation plate. The electronic device with the heat radiation plate according to an embodiment includes a coil portion that can be utilized for wirelessly charging or receiving power; the heat radiation plate arranged on one surface of the coil portion; and shell for accommodating the coil portion and the heat radiation plate in the inner part. A plurality of conductive type patches are arranged in the heat radiation plate in a continuous arrangement manner.

Description

technical field [0001] The invention relates to an electronic device with a heat dissipation plate. Background technique [0002] The trend of wireless transfer (Wireless Transfer) technology is to be widely used in electronic devices including various communication / portable terminals such as smart phones and wearable devices. [0003] In order to implement this wireless transmission technology in electronic equipment, a cooling scheme for coils for wireless power transmission is required. [0004] In the case of using a normal conductive heat dissipation member, an eddy current (Eddy Current) may be generated due to wireless transmission of electromagnetic waves, and a current loss due to the eddy current may occur. [0005] The current loss caused by the eddy current may lead to an extreme decrease in the efficiency of wireless transmission, or create a new hot spot. [0006] [Prior art literature] [0007] [Patent Document] [0008] (Patent Document 1) Korean Laid-Ope...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F38/14H01F27/28H01F27/22H05K7/20H02J50/10
CPCH02J7/025H05K7/209H01F27/22H01F27/2876H01F38/14H01F2038/143
Inventor 余淳正梁泰锡元载善成明铉金熙胜
Owner WITS CO LTD
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