Novel browning treatment fluid for printed circuit board

Abstract

The invention discloses a novel browning treatment fluid for a printed circuit board. Each liter of the browning treatment fluid comprises, by volume or mass, 35-65 ml of H2SO4, 35-60 ml of H2O2, 100-200 mg of CuSO4.5H2O, 3-6 g of ethylene glycol monomethyl ether, 5-10 g of methyl triethoxysilane, 13-19 g of benzotriazole, 0.5-10 g of an inhibitor and 1.2-1.5 g of EDTA, wherein the inhibitor comprises 2-sulfydryl-5-benzimidazole sodium sulfonate dehydrate and amino acid containing N and O heteroatoms. The cost of chemicals adopted by the browning treatment fluid is low, the reaction condition is mild, the treatment time is short, and treatment is stable; the surface of the board is high in acid resistance after the board is browned, the browning effect is good, and high peeling strength and excellent cold-heat impact resistance are achieved; and the problems of pink rings, poor tearing strength, poor acid resistance and the like of an ordinary browning treatment fluid can be effectively solved, and the novel browning treatment fluid has no pungent odor.

Description

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AI Technical Summary

Benefits of technology

This patented technology allows creators to selectively prevent or reduce damage caused by certain substances from affecting electronic devices during manufacturing processes such as printing circuit boardings. It involves treating an acidic copper surface (Cu2O2) layer that contains nitrous oxide (NO), hydrogen peroxy radicals (HOO· ), oxygen free radicals, water vapor molecules, etc.) with specific chemical structures called chlorosulfonated polyimides (CSPI). These chemistries have powerful binding properties towards metals like iron, nickel, cobalt, chromium, silver, gold, platinum, rhodium, ruthenium, tantaluminum, lanthanum, ceramics, polymers, rubbers, plasticizers, waxes, lubricants, greases, fats, polysaccharides, proteins, nucleic acids, carbohytes, mineral oil residue, organisms, bacteria, fungi, yeast cells, tissues, tumours, cellular membranes, enzyme systems, DNA sequences, antibiotic agents, cytokines, growth factors, hormones, histochemistry techniques, environmental impact studies, gene expression analysis methods, biological research tools, pharmacy testing procedures, and other applications involving these materials.

Problems solved by technology

Technological Problem: Current methods for producing multiplayer circuits involve attaching two types of materials together at once called bimodies that help connect them well without causing damage from environmental factors like humors and oxygen. However current techniques require expensive equipment and complicated processes, making these approaches less desirable than simpler alternatives. There is therefore a technical issue related to finding ways to increase the adhesion power of both the outermost part of the dielectric layer and other parts of the device's internal layer while maintaining desired characteristics including heat dissipativity, resistive property, insulation reliability, and compatibility with electrode coatings.

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