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Metal-bonded substrate

A substrate and metal technology, applied in the field of metal-bonded substrates, can solve problems such as poor adhesion, reduce processing costs, and overcome insufficient bonding force.

Inactive Publication Date: 2017-09-26
SAMSUNG CORNING PRECISION MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since glass-based materials have poor adhesion to Cu, a method or technique capable of enhancing the bonding strength between them is required.

Method used

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Embodiment Construction

[0037] Reference will now be made in detail to the metal bonded substrate according to the present disclosure, embodiments of the present disclosure are shown in the accompanying drawings and described below so that those skilled in the art to which the present disclosure pertains can easily practice the present disclosure.

[0038] Throughout this document, reference should be made to the accompanying drawings, wherein the same reference numerals and symbols will be used in different drawings to refer to the same or like components. In the following description, in cases where the subject matter of the present disclosure is unclear due to including the detailed descriptions of known functions and components incorporated herein, the detailed descriptions of known functions and components incorporated herein will be omitted.

[0039] Such as figure 1 As shown in , the metal bonding substrate 100 according to the exemplary embodiment may be applied to electronic devices such as ...

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Abstract

The present invention relates to a metal-bonded substrate and, more specifically, to a metal-bonded substrate in which the bonding force between a nonconductive substrate and a metal layer bonded to each other is remarkably improved. To this end, the present invention provides a metal-bonded substrate comprising: a substrate; a metal layer formed on the substrate; and a self-assembled monomolecular layer formed between the substrate and the metal layer, and composed of a silane chemically linking the substrate and the metal layer, wherein the end group of the silane is composed of an aminosilane containing a saturated or unsaturated hetero atom of a six-membered ring.

Description

technical field [0001] The present disclosure generally relates to a metal bonding substrate. More particularly, the present disclosure relates to a metal bonding substrate that significantly improves the bonding force between a non-conductive base substrate and a metal layer bonded thereto. Background technique [0002] Glass is used in various applications such as in a range of functional containers, vehicles and structural materials due to its high level of light transmittance, excellent thermal stability and excellent mechanical properties, and is used in applications such as smartphones and display devices in various electronic devices. In modern industry, technology-intensive fields have a greater demand for materials suitable for specific applications. Therefore, industrial fields requiring glasses having the above properties are increasing. Specifically, in electronic / electrical devices such as touch screens, display devices, and semiconductor base materials, elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/04B32B9/00B32B9/04B32B15/20B32B17/06B32B33/00
CPCB32B17/061B32B15/20B32B7/04B32B9/00B32B9/041B32B33/00
Inventor 金保京金贤斌李星勋
Owner SAMSUNG CORNING PRECISION MATERIALS CO LTD
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