Fine pitch package structure

Abstract

The invention relates to a fine pitch package structure which includes a line substrate, a chip and a heat dissipating sheet. The line substrate has a plurality of lines. Each line has a thickness of 4-8 [mu]m, and the width among the lines is between 10-18 [mu]m. The chip is disposed on the line substrate, and the right side of the chip faces towards the surface of the line substrate and is in electrical connection to the lines. The heat dissipating sheet is disposed on the back side of the chip and the surface of the line substrate so as to guide the heat generated by the chip to air and the line substrate. The fine pitch package structure can achieve fine effects and the effects of fast heat dissipation by means of the lines and the heat dissipating sheet.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a packaging structure with fine-pitch circuits. Background technique [0002] In order to meet the needs of miniaturization and high performance of electronic products, the size of the chip is usually miniaturized, and the performance of the chip is improved through IC design to meet the demand, so the conductors in the chip (such as conductor pads or bumps) and The spacing between the conductors must also be miniaturized accordingly. [0003] The existing known circuit substrate is used to electrically connect chips, and the circuit substrate has a plurality of circuits, and the circuits are made through patterned metal layers, so the thickness of the metal layer will affect the patterning process. The spacing between adjacent lines, that is to say, when the thickness of the metal layer is thicker, the spacing between adjacent lines is larger, and when the spacing between adjace...

AI Technical Summary

Problems solved by technology

[0003] The existing known circuit substrate is used to electrically connect chips, and the circuit substrate has a plurality of circuits, and the circuits are made through patterned metal layers, so the thickness of the metal layer will affect the patterning process. The spacing between adjacent lines, that is to say, when the thickness of the metal layer is thicker, the spacing between adjacent lines is larger, and when the spacing between adjacent lines is larger, it will cause the circuit substrate The circuit on the board cannot cooperate with the conductors in the miniaturized chip, so that the circuit substrate cannot be electrically connected with the miniaturized chip

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