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An air intake mechanism and a pre-cleaning chamber

A technology of air intake mechanism and air intake channel, which is applied in the direction of electrical components, circuits, discharge tubes, etc., can solve the problem of cover plate being polluted, achieve the effect of preventing pollution and improving the service life

Active Publication Date: 2019-07-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes an air intake mechanism and a pre-cleaning chamber, which can avoid the problem of the cover plate being polluted, thereby improving the service life of the equipment

Method used

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  • An air intake mechanism and a pre-cleaning chamber
  • An air intake mechanism and a pre-cleaning chamber
  • An air intake mechanism and a pre-cleaning chamber

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Experimental program
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Effect test

Embodiment 1

[0048] Please also refer to Figure 5 ~ Figure 7 , the air intake mechanism provided in this embodiment is located at the top of the process chamber, and includes a cover plate 6 and a protective plate 7 arranged at the bottom of the cover plate 6, and the two are fixedly connected by a plurality of screws 11, such as Figure 6 As shown, a plurality of screws 11 are symmetrically distributed along the circumference of the cover plate 6 . and, if Figure 5 As shown, an air intake channel 61 is provided in the cover plate 6, and the air intake end 611 of the air intake channel 61 extends to the bottom edge of the cover plate 6 and is connected with an air source (not shown in the figure); The gas outlet end of the channel 61 extends to the center of the cover plate 6 . A buffer cavity 9 is provided between the cover plate 6 and the protection plate 7 . Furthermore, an air outlet 71 is provided in the protective plate 7 , and the air outlet 71 is also located at the center of ...

Embodiment 2

[0053] Please also refer to Figure 8 ~ Figure 10 Compared with the above-mentioned first embodiment, the air intake mechanism provided by this embodiment is only different in that the structure of the blocking member 8 is different.

[0054] Specifically, the blocking member 8 includes a plate-shaped body that occupies the entire interior space of the buffer cavity 9, and there is a first channel between the plate-shaped body and the cover plate 6, such as Figure 9A As shown, the first channel includes a first concave portion 81 disposed on the plate-shaped body, the first concave portion 81 is located on the upper surface of the plate-shaped body, and forms the above-mentioned first channel with the top wall of the buffer chamber 9 opposite thereto. . In practical applications, the first recess 81 may not be provided, but a second recess is provided on the cover plate 6, the second recess is located on the lower surface of the cover plate 6, and forms the above-mentioned f...

Embodiment 3

[0062] Please also refer to Figure 11 and Figure 12 Compared with the above-mentioned first embodiment, the upper air intake mechanism provided by this embodiment is only different in that there are multiple buffer chambers 9 .

[0063] Specifically, a plurality of buffer cavities 9 are respectively located at the edge position and the center position of the cover plate 6 , and the plurality of buffer cavities 9 located at the edge positions of the cover plate 6 are symmetrically distributed along the circumference of the cover plate 6 . Each buffer cavity 9 is provided with the above-mentioned blocking member 8 . And, the quantity of the air outlet 612 of the air inlet channel 61 corresponds to the number of the above-mentioned buffer chambers 9, and the air outlet 612 of each air inlet passage 61 communicates with each buffer chamber 9 in a one-to-one correspondence; Figure 12 As shown, there are multiple air outlets 71 , the number of which corresponds to the number of...

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PUM

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Abstract

The invention provides an air intake mechanism and a pre-cleaning chamber. The air intake mechanism of the present invention includes a cover plate and a protection plate, wherein an air intake channel is arranged in the cover plate, and the air intake channel is connected with an air source; a buffer chamber is provided between the cover plate and the protection plate; A gas outlet is provided in the middle; the process gas provided by the gas source enters the process chamber through the inlet channel, the buffer chamber and the gas outlet in sequence, and the inlet mechanism also includes a blocking member, which is arranged in the buffer chamber and can block the outlet The air port is used to prevent particles entering the buffer chamber from the air outlet from reaching the cover plate to prevent the cover plate from being polluted. The pre-clean chamber of the present invention includes the gas inlet mechanism of the present invention. The air intake mechanism and the pre-cleaning chamber provided by the invention can prevent the cover plate from being polluted, thereby improving the service life of the equipment.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to an air intake mechanism and a pre-cleaning chamber. Background technique [0002] In physical vapor deposition process equipment, especially for integrated circuit (IC), through-silicon via (TSV), and packaging (Packaging) manufacturing processes, a pre-cleaning (Preclean) process chamber is required to perform a pre-cleaning process to deposit metal Contaminants on the wafer surface, or residues from the bottom of trenches and vias are removed prior to film application. The general pre-cleaning process is to excite the process gas, such as Ar (argon), He (helium), etc., into plasma, and use the chemical reaction and physical bombardment of the plasma to remove impurities from the wafer. [0003] At present, an upper gas inlet mechanism is usually arranged on the top of the reaction chamber to deliver the process gas into the reaction chamber. figure 1 It is a structural ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32
CPCH01J37/3244H01J37/32458H01J37/32862H01J2237/327H01J2237/335
Inventor 郭浩郑金果赵梦欣徐奎陈鹏丁培军
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD