Gradient distribution technique for cobalt in nickel-cobalt alloy plating layer of crystallizer copper plate and electroplating equipment

Abstract

The invention discloses a gradient distribution technique for cobalt in a nickel-cobalt alloy plating layer of a crystallizer copper plate. According to the technique, before plating, the cobalt content and other plating liquid components are analyzed, and plating liquid is prepared in primary and secondary tanks; electroplating begins to be conducted, and first-time liquid falling is conducted after electroplating is conducted for 10 h; second-time liquid falling is conducted after electroplating is conducted for 20 h; third-time liquid falling is conducted after electroplating is conducted for 30 h; fourth-time liquid falling is conducted after electroplating is conducted for 40 h; when the electroplating time before the thickness of the plating layer is achieved is 24 h, adding of the cobalt is stopped; after liquid falling is conducted for 10 h, at the moment, the cobalt content in electroplating liquid maintains 6 g/L and over, and the cobalt content in the plating layer is 30-35%; during the last 24 h, the cobalt is continuously consumed; after electroplating is conducted for 24 h, the cobalt content in a machining layer is 15%; and after electroplating is finished, a liquid feeding pump is closed, a liquid return pipe is pulled out to enable the plating liquid to completely flow back into the primary tank, and then the crystallizer copper plate provided with the plating layer with the gradient-distribution cobalt content is obtained. The problems that the traditional processing volume on a cobalt content plating layer is very large, a great number of materials are wasted, and the product cost is increased are solved.

Description

technical field [0001] The invention relates to a method for electroplating a Ni-Co alloy on a crystallizer copper plate, in particular to a gradient distribution process and an electroplating device for a nickel-cobalt alloy plating layer on a crystallizer copper plate. Background technique [0002] Among the original electroplating methods, the most common one is bath immersion electroplating. In this electroplating method, the copper plate of the crystallizer is immersed in a bath, and cobalt ions are added to the bath according to the consumption of kiloampere hours. After electroplating in this way, the entire The thickness of the coating on the copper plate of the crystallizer is roughly the same, and the distribution of cobalt is relatively uniform in each position of the coating. [0003] The defects and deficiencies of bath immersion plating are: [0004] 1. The structure of the electroplating layer is unreasonable. The overall design of the crystallizer copper pl...

AI Technical Summary

Problems solved by technology

The copper plating layer after electroplating needs to be mechanically processed. Since the overall thickness of the copper plate using tank immersion plating is the same, in order to meet the design taper, the subsequent processing of the plating layer is very large, wasting a lot of materials and increasing the cost of the product.

[0005] 2. The distribution of cobalt is unreasonable

[0010] It can be seen that the

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