Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A Portable Method of FPGA Application Circuit

A circuit and circuit interface technology, applied in the computer field, can solve the problems of low portability of FPGA application circuits, and achieve the effects of realizing portability, reducing the difficulty of deployment and use, and improving development efficiency.

Active Publication Date: 2020-10-09
苏州研鸥科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above problems, the present invention provides a method for transplanting FPGA application circuits, which solves the defects of low portability of FPGA application circuits and the need for directional development for different FPGA platforms in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A Portable Method of FPGA Application Circuit
  • A Portable Method of FPGA Application Circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] In order to make the technical problems, technical solutions and advantages to be solved by the present invention more clear, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. The description here does not mean that all the subjects corresponding to the specific examples stated in the embodiments are in cited in the claims.

[0020] In this embodiment, the FPGA development platform represents the FPGA platform used when developing the application circuit, the FPGA deployment platform represents the FPGA platform used when deploying the application circuit, SHELL represents the basic function circuit of the FPGA platform, SUBSHELL represents the interface adaptation layer circuit, and IP( Intellectual Property) indicates the application circuit; SUBSHELL X indicates the interface adaptation layer circuit of the corresponding FPGA development platform selected from the interface adaptation layer library, and S...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a transportable method for an FPGA (field programmable gate array) application circuit. The transportable method includes the steps: developing an interface adapter layer library capable of providing a unified application circuit interface in different FPGA platforms; selecting an interface adapter layer circuit corresponding to an FPGA development platform from the interface adapter layer library to develop an application circuit; selecting an interface adapter layer circuit corresponding to an FPGA deployment platform from the interface adapter layer library deploy the application circuit; performing composition and compilation on the developed application circuit, the interface adapter layer circuit corresponding to the FPGA deployment platform and a basic functional circuit of the FPGA deployment platform to generate a configuration file corresponding to an FPGA hardware circuit. The interface adapter layer library comprises a plurality of interface adapter layer circuits, and each interface adapter layer circuit is used for converting specific application circuit interfaces corresponding to the FPGA platforms into a unified application circuit interface. The transportable method has the advantages that reusability and transportability of application circuits are achieved, the application circuits are developed once and can be repeatedly deployed in a cross-platform manner, developed efficiency of the application circuits is improved, and deployment difficulty of the application circuits is reduced.

Description

technical field [0001] The invention belongs to the technical field of computers, and in particular relates to a method for transplanting FPGA application circuits. Background technique [0002] With the development of computer science and technology and the continuous expansion of application fields, more computing devices with high performance and low power consumption are required to meet the growing computing needs. General-purpose processors (CPUs) have experienced decades of development, and as Moore's Law is approaching the limit, the room for improving the energy efficiency ratio is quite limited. In order to achieve further performance improvement, it has become necessary to customize processors for industrial core applications (artificial intelligence, big data processing, etc.). As a result, FPGA chip technology has gradually entered the public's field of vision. FPGA has the characteristics of hardware reconfigurability, low power consumption, and low latency. I...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/343G06F117/08
CPCG06F30/327G06F30/34G06F2117/08
Inventor 赵谦孙猛
Owner 苏州研鸥科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products