Integrated pressure-sensitive fingerprint packaging structure and fingerprint module

Abstract

The invention discloses an integrated pressure-sensitive fingerprint packaging structure and an integrated pressure-sensitive fingerprint module. The integrated pressure-sensitive fingerprint packaging structure integrally packages a pressure sensing module and a fingerprint biological identification module in the same structure, thus a new fingerprint packaging method is proposed, namely, the traditional pressure sensing module (a thin film pressure sensitive piece) and the fingerprint identification module (a fingerprint chip) are integrated in the same packaging structure, thus the packaging structure as a stress sensing characteristic of a pressure sensing thin film and a fingerprint biological identification characteristic of a silicon wafer, and the use flexibility and reliability of pressure and fingerprints can be effectively improved, therefore, the design space is reduced, the performances are improved, a new interactive experience is brought for various types of electronic interactive equipment, and the equipment interacting on the mobile internet is more effective and rapid.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an integrated pressure-sensitive fingerprint packaging structure and an integrated pressure-sensitive fingerprint module. Background technique [0002] The structure of traditional electronic equipment with two modules of pressure sensing and fingerprint recognition is as follows: figure 1 Shown: including fingerprint identification chip 100, pressure sensing chip 300, circuit board 200 and pressure support 500 (usually made of rubber), the fingerprint identification chip is connected to the front of the fingerprint circuit board by SMT welding, and the pressure sensing chip is embedded in the pressure support After the front of the component is connected to the back of the circuit board by SMT welding, the pressure support is connected to the back of the fingerprint circuit board with glue 400, and the electronic device 600 (including the control circuit) used to...

AI Technical Summary

Problems solved by technology

This method of stacking two modules up and down has great limitations in actual design because of its relatively thick thickness, and in the process of use, there is a certain degree of deformation and positional movement of the pressure support, which leads to a decrease in the sensitivity of electronic equipment. , there are bad phenomena such as Caton

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