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Chipboard hot-pressing method

A hot-pressing method and particleboard technology, applied in the field of particleboard hot-pressing, can solve the problems of high free formaldehyde content in finished boards, low hot-pressing work efficiency, large adhesive consumption, etc., to achieve stable product quality, high production efficiency, The effect of reducing the scrap rate

Inactive Publication Date: 2017-10-27
广西祥盛家居材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the hot-pressing process of particleboard has long hot-pressing time, low hot-pressing efficiency, large consumption of raw materials, large consumption of adhesive, and high content of free formaldehyde in the finished board. A hot-pressing production process with low free formaldehyde content to manufacture particleboard

Method used

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Experimental program
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Effect test

Embodiment 1

[0023] A method for hot-pressing particle boards, which adopts the method of hot-pressing with a continuous flat-pressing hot-pressing machine. The pre-pressed slabs are sequentially passed through a high-pressure hot-pressing zone, a low-pressure hot-pressing zone, and a secondary pressurized hot-pressing zone. The hot pressing pressure of the zone is 1.5N / mm 2 , the hot-pressing temperature is 220°C; the hot-pressing pressure in the low-pressure hot-pressing zone is 1.0N / mm 2 , the hot-pressing temperature is 210°C; the hot-pressing pressure in the secondary pressing hot-pressing zone is 0.8N / mm 2 , the hot-pressing temperature is 190° C.; the hot-pressing factor is 4.5 s / mm.

[0024] The slab is a three-layer structure slab paved with two layers of surface fine shavings and a layer of core layer coarse shavings, the moisture content of the surface fine shavings is 10.5%, and the moisture content of the core layer coarse shavings is 5.5%; The fine shavings in the surface l...

Embodiment 2

[0026] A method for hot-pressing particle boards, which adopts the method of hot-pressing with a continuous flat-pressing hot-pressing machine. The pre-pressed slabs are sequentially passed through a high-pressure hot-pressing zone, a low-pressure hot-pressing zone, and a secondary pressurized hot-pressing zone. The hot pressing pressure of the zone is 4.5N / mm 2 , the hot-pressing temperature is 230°C; the hot-pressing pressure in the low-pressure hot-pressing zone is 3.2N / mm 2 , the hot-pressing temperature is 225°C; the hot-pressing pressure in the secondary pressing hot-pressing zone is 2.5N / mm 2 , the hot-pressing temperature is 195° C.; the hot-pressing factor is 6.4 s / mm.

[0027] The slab is a three-layer structure slab paved with two layers of surface layer fine shavings and a layer of core layer coarse shavings, the moisture content of the surface layer fine shavings is 11.5%, and the moisture content of the core layer coarse shavings is 6.0%; The fine shavings in t...

Embodiment 3

[0029] A method for hot-pressing particle boards, which adopts the method of hot-pressing with a continuous flat-pressing hot-pressing machine. The pre-pressed slabs are sequentially passed through a high-pressure hot-pressing zone, a low-pressure hot-pressing zone, and a secondary pressurized hot-pressing zone. The hot pressing pressure in the zone is 3.0N / mm 2 , the hot-pressing temperature is 225°C; the hot-pressing pressure in the low-pressure hot-pressing zone is 2.2N / mm 2 , the hot-pressing temperature is 215°C; the hot-pressing pressure in the secondary pressing hot-pressing zone is 1.25N / mm 2, the hot-pressing temperature is 190° C.; the hot-pressing factor is 5.2 s / mm. The pressure of preloading is 1.2MPa.

[0030] The slab is a three-layer structure slab paved with two layers of surface fine shavings and a layer of core layer coarse shavings, the moisture content of the surface fine shavings is 10.5%, and the moisture content of the core layer coarse shavings is 5....

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Abstract

The invention discloses a chipboard hot-pressing method. The method of conducting hot pressing through a continuous flat hot press is adopted, a board blank obtained after prepressing sequentially passes through a high-pressure hot-pressing region, a low-pressure hot-pressing region and a secondary pressurizing hot-pressing region, the hot-pressing pressure and hot-pressing temperature of the high-pressure hot-pressing region are 1.5-4.5 N / mm<2> and 220-230 DEG C respectively, the hot-pressing pressure and hot-pressing temperature of the low-pressure hot-pressing region are 1.0-3.2 N / mm<2> and 210-225 DEG C respectively, the hot-pressing pressure and hot-pressing temperature of the secondary pressurizing hot-pressing region are 0.8-2.5 N / mm<2> and 190-195 DEG C respectively, and the hot-pressing factor is 4.5-6.4 s / mm. The chipboard hot-pressing method is reasonable in process, compared with a traditional chipboard hot-pressing process, hot-pressing time is greatly shortened, and the production efficiency is high; product quality stability is improved, the product rejection rate is greatly reduced, production cost is reduced, and enterprise benefits are increased.

Description

technical field [0001] The invention relates to the technical field of wood processing, in particular to a particle board hot pressing method. Background technique [0002] Particleboard, also known as particle board, is made of wood or other wood fiber materials and scraps. Usually the wood is mainly branch wood, and it is a wood-based panel that is glued under heat and pressure after applying an adhesive. As one of the three major wood-based panels, particleboard is mainly used in interior decoration, furniture production and other fields. At present, the hot-pressing process of particleboard has long hot-pressing time, low hot-pressing work efficiency, large consumption of raw materials, large consumption of adhesive, and high free formaldehyde content of the finished board. Particleboard is produced by a hot-pressing production process with low free formaldehyde content. Contents of the invention [0003] The object of the present invention is to: aim at the above ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/10
CPCB27N3/10
Inventor 韦仁刚韦隽永马升清
Owner 广西祥盛家居材料科技股份有限公司
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