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A kind of multilayer gold electrode chip capacitor and its preparation method

A technology of electrode chips and multi-layer chips, which is applied in the field of capacitors to achieve the effects of reducing installation space, avoiding high temperature oxidation, and avoiding silver migration

Active Publication Date: 2019-04-16
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of preparation method of chip multilayer gold electrode chip capacitor, this method not only solves the problem of traditional Pd / Ag electrode in high temperature and high Silver migration problem in wet working environment, and high temperature oxidation of Ni / Cu electrode is avoided, which greatly improves the reliability of the product

Method used

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  • A kind of multilayer gold electrode chip capacitor and its preparation method
  • A kind of multilayer gold electrode chip capacitor and its preparation method
  • A kind of multilayer gold electrode chip capacitor and its preparation method

Examples

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preparation example Construction

[0024] refer to Figure 1 to Figure 5 , a method for preparing a chip multilayer gold electrode chip capacitor, comprising:

[0025] Prepare ceramic medium porcelain powder with various raw materials, and then make ceramic medium porcelain powder into green porcelain diaphragm;

[0026] Make internal electrodes made of gold on the green ceramic diaphragm;

[0027] The terminal electrode is prepared by thin film sputtering process;

[0028] Among them, various raw materials are counted in parts by weight, including: 90-110 parts of BaTiO 3 , 0.3-2 parts of Nb 2 o 5 , 0.3~1.5 parts of Nd 2 o 3 , 0.5-1 part of CaCO 3 , 0.1 to 0.5 parts of SiO 2 , 0.1 to 0.5 parts of MnCO 3 , 0.1 to 0.5 parts of ZnO, 0.3 to 2 parts of H 2 BO 3 And 0.5~4 parts of ZnO-B 2 o 3 -SiO 2 Glass.

[0029] In the embodiment of the present invention, a variety of raw materials are used to prepare ceramic medium porcelain powder, and then the ceramic medium porcelain powder is made into a green...

Embodiment 1

[0045] This embodiment provides a chip capacitor with multilayer gold electrodes, which is prepared by the following method:

[0046] The ground and dispersed slurry formed by sand grinding and mixing various raw materials is spray-dried, and the dried mixture is pre-fired at a temperature of 500 °C and kept for 1.5 hours to obtain ceramic medium porcelain powder, and then the ceramic Dielectric porcelain powder, absolute ethanol, dispersant, defoamer and PVB are used to make a slurry, and the slurry is sequentially passed through a casting machine and a cutting machine to obtain a 4-inch green ceramic diaphragm;

[0047] Among them, various raw materials are counted in parts by weight, including: 90 parts of BaTiO 3 , 0.3 part Nb 2 o 5 , 0.3 Nd 2 o 3 , 0.5 parts of CaCO 3 , 0.1 part of SiO 2 , 0.1 part of MnCO 3 , 0.5 parts of ZnO, 0.3 parts of H 2 BO 3 and 0.4 parts of ZnO-B 2 o 3 -SiO 2 Glass. ZnO-B 2 o 3 -SiO 2 The glass is made by adding 70wt% ZnO, 25wt% B...

Embodiment 2

[0052] refer to image 3 , this embodiment provides a chip capacitor with multilayer gold electrodes, which is prepared by the following method. The difference between this method and the method provided in Example 1 is:

[0053] The ground and dispersed slurry formed by sand grinding and mixing various raw materials is spray-dried, and the dried mixture is pre-fired at a temperature of 700°C and kept for 2 hours to obtain ceramic medium porcelain powder, and then the ceramic Dielectric porcelain powder, toluene, dispersant, defoamer and PVB are used to make a slurry, and the slurry is passed through a casting machine and a cutting machine in sequence to obtain a 6-inch green ceramic diaphragm;

[0054] Among them, various raw materials are counted in parts by weight, including: 100 parts of BaTiO 3 , 1 Nb 2 o 5 , 1 Nd 2 o 3 , 0.7 parts of CaCO 3 , 0.3 parts of SiO 2 , 0.4 parts of MnCO 3 , 0.3 parts of ZnO, 1 part of H 2 BO 3 and 2 parts of ZnO-B 2 o 3 -SiO 2 Gla...

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Abstract

The invention provides a chip capacitor with multilayer gold electrodes and a preparation method thereof, and relates to the technical field of capacitors. This chip multilayer gold electrode chip capacitor is prepared by using the preparation method of a chip multilayer gold electrode chip capacitor: use a variety of raw materials to prepare ceramic dielectric porcelain powder, and then make ceramic dielectric porcelain powder into green ceramic diaphragm ; The inner electrode made of gold is made on the green ceramic diaphragm; the terminal electrode is prepared by thin film sputtering process. The equivalent series resistance of this chip multilayer gold electrode chip capacitor is significantly low, avoiding the problem of silver migration of Pd / Ag electrodes and high temperature oxidation of Ni / Cu electrodes in a high-temperature and high-humidity working environment, and greatly improving the stability of the product , which solves the problem that the interdiffusion between the terminal electrode and the internal electrode reduces the performance index, further improves the reliability of the product, and is suitable for the micro-assembly process requirements of gold wire or gold ribbon welding, can reduce the installation space, and is easy to achieve large-scale Production.

Description

technical field [0001] The invention relates to the technical field of capacitors, and in particular to a chip multilayer gold electrode chip capacitor and a preparation method thereof. Background technique [0002] (MLCC (Multi-layer Ceramic Capacitor) chip multilayer ceramic capacitor has the advantages of large capacity, small size, low internal inductance, high insulation resistance, small leakage current, low dielectric loss, etc., and is widely used in various electronic machines Oscillation, coupling, filtering and bypass circuits, especially in high-frequency circuits. Compared with other capacitors, MLCC is especially suitable for chip surface assembly, which can greatly increase the circuit assembly density and reduce the volume of the whole machine. This outstanding The characteristics of chip MLCC have made chip MLCC the most widely used and fastest-growing chip component in the world. In recent years, the demand for chip MLCC in the international market has grow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/12H01G4/008H01G4/232C04B35/468C03C3/066C04B41/88
CPCC03C3/066C04B35/468C04B41/5116C04B41/88C04B2235/3208C04B2235/3224C04B2235/3251C04B2235/3262C04B2235/3284C04B2235/3409C04B2235/3418C04B2235/6025C04B2235/656C04B2235/94C04B2235/95H01G4/008H01G4/1227H01G4/2325H01G4/30C04B41/4529
Inventor 何创创庞锦标班秀峰刘婷居奎韩玉成
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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