Terahertz jumperless inverted coplanar waveguide monolithic circuit package transition structure

Abstract

The invention discloses a terahertz jumperless inverted coplanar waveguide monolithic circuit package transition structure. The terahertz jumperless inverted coplanar waveguide monolithic circuit package transition structure is characterized by comprising a lower cavity, an upper cavity and a coplanar waveguide circuit, wherein the upper cavity covers the lower cavity to form a rectangular waveguide cavity, a coplanar waveguide circuit shielding cavity and a monolithic circuit shielding cavity which are sequentially connected, a monolithic circuit is arranged in the monolithic circuit shielding cavity, and a coplanar waveguide circuit is arranged in the coplanar waveguide circuit shielding cavity and is connected with the monolithic circuit. With the terahertz jumperless inverted coplanar waveguide monolithic circuit package transition structure provided by the invention, the loss of a chip package structure in a terahertz frequency band can be reduced, the package performance is improved, the process complexity and cost are reduced, and the terahertz jumperless inverted coplanar waveguide monolithic circuit package transition structure is simple and is convenient to design and manufacture.

Description

technical field [0001] The invention belongs to the field of monolithic circuit packaging technology and terahertz device technology, and specifically relates to a terahertz jumper-free inverted coplanar waveguide monolithic circuit packaging transition structure. Background technique [0002] Terahertz covers a wide spectrum range from 100 GHz to 10 THz, with a wavelength range of 3 mm to 30 microns, and has some characteristics of microwave and infrared rays. Its spectrum range is wider than that of microwave, and the information capacity is increased, which is suitable for high-speed and large-capacity communication; the signal-to-noise ratio of terahertz radiation is high, and it is suitable for high-quality imaging; its radiation energy is small, and it can penetrate ceramics, cloth, plastic, fat And other materials, the attenuation is small. Terahertz monolithic circuits include terahertz amplifiers, frequency multipliers, mixers, signal transceiver systems, etc., and...

AI Technical Summary

Problems solved by technology

There are many forms of conversion between rectangular waveguide and planar transmission line. The commonly used ones are mainly waveguide-ridge waveguide-microstrip transition, waveguide-microstrip probe transition and waveguide-probe-microstrip transition. These traditional microwave transition structures are difficult to integrate with on-chip circuits. The probe test structures (pads) are directly interconnected

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