Efficient heat dissipation device for mold

Abstract

The invention discloses an efficient heat dissipation device for a mold. The device comprises a workbench; a deep groove is formed in the top of the workbench; first condensing pipes are arranged in an inner cavity of the deep groove; a lower mold is fixedly connected at the top of the workbench and located on the surface of the deep groove; second condensing pipes are arranged on the surface of the lower mold; supporting columns are fixedly connected at the top of the workbench and located on two sides of the lower mold; a supporting plate is fixedly connected at the tops of the supporting columns; and an electric telescopic rod is fixedly connected at the front end of the bottom of the supporting plate. With the device, through matched use of the workbench, the deep groove, the first condensing pipes, the lower mold, the second condensing pipes, a condensate box, a water pump, a hose, two-way pipes and grooves, efficient, quick and comprehensive heat dissipation can be performed on the mold, the defects such as local shrinkage cavities, uneven shrinkage, looseness and the like of a product can be avoided, the percent of pass and the quality of the product are increased, the production cost is reduced, and the production progress is accelerated.

Description

technical field [0001] The invention relates to the technical field of molds, in particular to a high-efficiency mold cooling device. Background technique [0002] At present, the usual heat dissipation method in the mold industry is mainly through the gas medium. However, due to the different sizes and shapes of the parts of each product, especially the parts with complex shapes and high performance requirements, higher requirements are placed on the rationality and heat dissipation of the mold structure. The heat dissipation of the gas medium cannot completely intervene in the mold, and the product parts will have defects such as shrinkage cavities, uneven shrinkage, and looseness in parts where the gas medium cannot reach, resulting in low molding pass rate and poor quality stability, increasing production costs and affecting production progress. Contents of the invention [0003] The purpose of the present invention is to provide a high-efficiency mold heat dissipatio...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a high-efficiency mold heat dissipation device, which has the advantages of good heat dissipation effect, and solves the problem that the heat dissipation of the gas medium cannot be completely involved in the mold, and product parts will produce shrinkage cavities, uneven shrinkage, and looseness in parts where the gas medium cannot reach. Defects such as low molding pass rate, poor quality stability, increased production costs, and affecting production progress

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