Method for preparing Micro LED display device
A display device and a part of the technology, applied in the field of preparation of Micro LED display devices, can solve problems such as difficult to achieve high-density coating or high-resolution display of quantum dots, difficult to achieve coating film accuracy or uniformity, and color quality degradation , to achieve high density distribution and size uniformity, improve yield and display quality, and reduce mutual influence
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Embodiment 1
[0048] The following steps are used to prepare the Micro LED display device:
[0049] Prepare the blue Micro LED chip 2 array on the substrate 1, the structure of the Micro LED chip array is as follows figure 1 shown;
[0050] Prepare mask plate 1: use photolithography to prepare mask plate 1. The mask plate 1 has an opaque portion 3 and is located in row 2i-1 and column 2j-1 with the array of Micro LED chips 2 (i, j=1, 2, 3...n) Micro LED chip 2 corresponding to the light-transmitting part 4, the three-dimensional structure of the mask plate 1 is as follows figure 2 As shown, the top view is as image 3 shown;
[0051] Prepare substrate one 5: evaporate a layer of endothermic material one 7 on the substrate one 6;
[0052] The red quantum dot material 8 is coated on the heat-absorbing material 1 by inkjet printing technology. The substrate is a flexible polymer film with a thickness of 0.15 mm. The heat-absorbing material is composed of a three-layer structure. One laye...
Embodiment 2
[0062] The following steps are used to prepare the Micro LED display device:
[0063] Micro LED chip array 2 is prepared on the substrate 1, the structure diagram of the Micro LED chip array is as follows Figure 8 shown;
[0064] Preparing the third mask: using photolithography technology to prepare the third mask, the third mask has a light-transmitting part corresponding to all the Micro LED chips 2 in the Micro LED chip 2;
[0065] Preparation of substrate 3: Evaporate a layer of endothermic material on the substrate;
[0066] Use laser printing technology to print the red quantum dot material to the position corresponding to the 3j position in the 2i-1 column of the Micro LED chip and the 2j-1 position in the 2i column (i,j=1,2,3...n) On the heat-absorbing material, print the green quantum dot material to correspond to the 3j-2 position in the 2i-1 column of the Micro LED chip and the 2j-th position in the 2i column (i,j=1,2,3...n) On the endothermic material, the thic...
Embodiment 3
[0071] The following steps are used to prepare the Micro LED display device:
[0072] Micro LED chip 2 array is prepared on substrate 1, and the structure of Micro LED chip 2 array is as follows Figure 8 As shown, the Micro LED chip 2 is a blue Micro LED chip;
[0073] Prepare mask plate 4: use photolithography to prepare mask plate 4, the mask plate 4 has the same structure as Micro LED chip 2 in column 2i-1, column 3j, column 2i-1, column 3j-2, column 2i The light-transmitting part corresponding to the 2j-1th and the 2jth position (i,j=1,2,3...n) of the 2ith column;
[0074] Preparation of substrate 4: Evaporate a layer of endothermic material on the substrate;
[0075] Use laser printing technology to print the red quantum dot material to the position corresponding to the 3j position in the 2i-1 column of the Micro LED chip and the 2j-1 position in the 2i column (i,j=1,2,3...n) On the heat-absorbing material, print the green quantum dot material to correspond to the pos...
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