Metal material patterning method
A metal material and graphic technology, applied in the field of materials, can solve problems such as complex operation of metal materials, and achieve the effect of easy peeling
Active Publication Date: 2019-07-02
YUNGU GUAN TECH CO LTD
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Problems solved by technology
However, this patterning technology needs to remove the metal material in the pattern window through an etching process, which makes the operation of the patterning process of the metal material more complicated.
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[0035] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0036] The technical solutions provided by various embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.
[0037] As mentioned above, when the current patterning technology makes a conductive layer on the substrate, refer to the attached figure 1 Firstly, a metal material layer 12 and ...
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The invention discloses a metal material patterning method. The metal material patterning method comprises the steps of generating a metal nanomaterial layer and a protection layer on a provided substrate in sequence, wherein the difference between the coefficient of thermal expansion of the protection layer and the coefficient of thermal expansion of the substrate is greater than a preset threshold value; performing patterning treatment on the protection layer for forming a channel in the protection layer; and performing heat treatment on the protection layer, the metal nanomaterial layer and the substrate so as to strip the metal nanomaterial in the channel based on different thermal expansion degrees of the protection layer and the substrate. The difference between the coefficient of thermal expansion of the protection layer and the coefficient of thermal expansion of the substrate is greater than the preset threshold value, so that the metal nanomaterial in the channel can be stripped off based on different thermal expansion degrees of the protection layer and the substrate, thereby solving the problem in the prior art.
Description
technical field [0001] The present application relates to the field of material technology, in particular to a method for patterning metal materials. Background technique [0002] In the process of semiconductor component manufacturing, touch screen manufacturing, etc., patterning technology is usually used to make a patterned metal conductive layer on the substrate. [0003] When the current patterning technology makes a conductive layer on a substrate, firstly a metal material layer and a protective layer are formed on the substrate, and then a mask plate with a pattern window is used for shielding, and after shielding, the protective layer is exposed and developed, thereby protecting layer to form a pattern window, and finally the metal material in the pattern window is removed by an etching process to produce a patterned metal conductive layer. However, this patterning technique needs to remove the metal material in the pattern window through an etching process, which m...
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IPC IPC(8): H01L21/3205H01L21/321B82Y30/00
CPCB82Y30/00H01L21/32051H01L21/321
Inventor 李阳陶国胜张成明刘晓佳
Owner YUNGU GUAN TECH CO LTD