Fast packaging operation method for PCBs

Abstract

A fast packaging operation method for PCBs comprises the following specific steps that (1) the proper number of PCBs and corresponding auxiliary materials are arranged in a pre-arrangement area according to requirements of customers; (2) a packaging start button is pressed, and a base plate loaded with the PCBs in the pre-arrangement area is automatically conveyed to a vacuum packaging area through a vacuum packaging auxiliary conveying platform for vacuum packaging operation; (3) after vacuum packaging operation is completed, a mechanical handle in a temporary storage and cooling area is started automatically so as to pull the base plate of the vacuum packaging area into the temporary storage and cooling area for cooling, and then the base plate is transferred to an unpacking area for unpacking; and (4) after unpacking, the base plate is horizontally transferred to the pre-arrangement area, and thus a circulating operation mode is formed. According to the fast packaging operation method, the packaging operation procedure for the finished PCBs is optimized, and arrangement in the packaging operation link is reasonable, so that the production efficiency is improved, and the labor intensity of workers is relieved.

Description

technical field [0001] The invention relates to a packaging operation method, in particular to a PCB board rapid packaging operation method Background technique [0002] In the vacuum packaging operation of PCB boards, first put the bottom plate, put the bubble film, then put the PCB printed circuit board, and then push it flat to carry out thermal vacuum packaging, and then take out the vacuum machine to divide and pack. In this operation process, the staff needs to Walking back and forth, every time a board is packaged, the bottom plate of the package must be removed and passed to the front of the package, so as to circulate. [0003] As far as the existing vacuum packaging process is concerned, after the pre-composition is completed, the chassis with arranged PCB boards needs to be manually pushed into the vacuum packaging machine for vacuum packaging. In addition, the packaging chassis (aluminum board) cannot be automatically recycled. After the packaging is disassemble...

AI Technical Summary

Problems solved by technology

[0003] As far as the existing vacuum packaging process is concerned, after the pre-composition is completed, the chassis with arranged PCB boards needs to be manually pushed into the vacuum packaging machine for vacuum packaging. In addition, the packaging chassis (aluminum board) cannot be automatically recycled. After the packaging is disassembled, it is necessary to manually remove the packaging chassis and take it to the pre-typesetting area for pre-typesetting operations, so as to achieve the purpose of recycling. It can be seen that there are unreasonable design of work links, unsmooth operation process of employees, and poor work efficiency. Low level defects

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