Fast packaging operation method for PCBs

A PCB board, fast technology, applied in packaging, packaging under vacuum/special atmosphere, etc., can solve the problems of low work efficiency, unreasonable design of work links, and unsmooth work flow of employees, so as to reduce the labor intensity of workers and improve production. The effect of efficiency

Inactive Publication Date: 2017-11-24
AOSHIKANG TECH CO LTD
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  • Claims
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Problems solved by technology

[0003] As far as the existing vacuum packaging process is concerned, after the pre-composition is completed, the chassis with arranged PCB boards needs to be manually pushed into the vacuum packaging machine for vacuum packaging. In addition, the packaging chassis (aluminum board) cannot be automatically recycled. After the packaging i

Method used

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  • Fast packaging operation method for PCBs

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Embodiment

[0018] refer to figure 1 , a quick packaging operation method, the specific steps are as follows:

[0019] (1) Arrange PCB boards and corresponding auxiliary materials in the pre-layout ① area according to the quantity required by the customer;

[0020] (2) Then press the packaging start button, and the vacuum packaging auxiliary conveying platform will automatically transport the chassis (aluminum board) equipped with PCB boards in the pre-typesetting area ① to the vacuum packaging area ② for vacuum packaging operations;

[0021] (3) After the vacuum packaging operation is completed, the mechanical handle in the temporary storage cooling ③ area is automatically activated, and the chassis in the vacuum packaging ② area is pulled to the temporary storage cooling ③ area for cooling, and then transferred to the packaging split ④ area for packaging splitting ;

[0022] (4) After the package is disassembled, move the chassis horizontally to the pre-composition ① area to form a cy...

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Abstract

A fast packaging operation method for PCBs comprises the following specific steps that (1) the proper number of PCBs and corresponding auxiliary materials are arranged in a pre-arrangement area according to requirements of customers; (2) a packaging start button is pressed, and a base plate loaded with the PCBs in the pre-arrangement area is automatically conveyed to a vacuum packaging area through a vacuum packaging auxiliary conveying platform for vacuum packaging operation; (3) after vacuum packaging operation is completed, a mechanical handle in a temporary storage and cooling area is started automatically so as to pull the base plate of the vacuum packaging area into the temporary storage and cooling area for cooling, and then the base plate is transferred to an unpacking area for unpacking; and (4) after unpacking, the base plate is horizontally transferred to the pre-arrangement area, and thus a circulating operation mode is formed. According to the fast packaging operation method, the packaging operation procedure for the finished PCBs is optimized, and arrangement in the packaging operation link is reasonable, so that the production efficiency is improved, and the labor intensity of workers is relieved.

Description

technical field [0001] The invention relates to a packaging operation method, in particular to a PCB board rapid packaging operation method Background technique [0002] In the vacuum packaging operation of PCB boards, first put the bottom plate, put the bubble film, then put the PCB printed circuit board, and then push it flat to carry out thermal vacuum packaging, and then take out the vacuum machine to divide and pack. In this operation process, the staff needs to Walking back and forth, every time a board is packaged, the bottom plate of the package must be removed and passed to the front of the package, so as to circulate. [0003] As far as the existing vacuum packaging process is concerned, after the pre-composition is completed, the chassis with arranged PCB boards needs to be manually pushed into the vacuum packaging machine for vacuum packaging. In addition, the packaging chassis (aluminum board) cannot be automatically recycled. After the packaging is disassemble...

Claims

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Application Information

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IPC IPC(8): B65B35/30B65B31/02B65B61/00
CPCB65B35/30B65B31/02B65B61/00
Inventor 陈志新李想陈红艳贺文辉
Owner AOSHIKANG TECH CO LTD
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