Electronic component packaging bag

Abstract

The invention discloses an electronic component packaging bag which comprises a bag body. The bag body sequentially comprises a protection layer, a base layer and an anti-static layer from outside to inside. The base layer is an aluminum film layer, and the inner side surface of the base layer is provided with concave portions. The protection layer is a polytetrafluoroethylene coating with which the outer side surface of the base layer is coated, and the thickness of the protection layer is 5-15 micrometers. The anti-static layer is a braid layer comprising anti-static fiber. The bag body further comprises moisture absorption matter which is placed into the concave portions in the base layer. The packaging bag has the effect of absorbing moisture in packaging internal space or electronic components, and the problem that the electronic components are likely to be affected by moisture and damaged is solved; the electronic components in the packaging bag can be effectively protected against damage of static, the problem that the electronic components are impacted by static in the storage and transfer process is solved, effectiveness of the electronic components is ensured, and the service life of the electronic components is prolonged.

Description

technical field [0001] The invention relates to a packaging bag for electronic components, in particular to a moisture-proof and antistatic electronic component packaging bag. Background technique [0002] At present, the application range of electronic products is becoming wider and wider. Due to the complex structure of electronic components, they are easily damaged by static electricity and water molecules during circulation and use. The lighter ones will cause the electrical parameters of electronic components to drift and shorten the life. In severe cases, the electronic components will completely fail; the circuit of integrated circuit components will be reduced, the withstand voltage will be reduced, and the circuit area will be reduced, which will weaken the device's ability to withstand electrostatic shocks. Electrostatic electric fields and electrostatic currents will become the fatal killers of these high-density components. [0003] At this stage, due to the wide...

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Problems solved by technology

[0002] At present, the application range of electronic products is becoming wider and wider. Due to the complex structure of electronic components, they are easily damaged by static electricity and water molecules during circulation and use. The lighter ones will cause the electrical parameters of electronic components to drift and shorten the life. In severe cases, the electronic components will completely fail; the circuit of integrated circuit components will be reduced, the withstand voltage will be reduced, and the circuit area will be reduced, which will weaken the device’s ability to withstand electrostatic shocks. Electrostatic electric fields and electrostatic currents will become the fatal killers of these high-density components.

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