Polysilicon slicing method

Abstract

The invention relates to a polysilicon slicing method and belongs to the field of the preparation of silicon crystals. The polysilicon slicing method comprises the steps of component cleaning, glue preparation, material sticking and slicing. According to the polysilicon slicing method, the inclined cutting design is adopted; in a cutting process, the slow grooving operation is performed preferentially; the vertical cutting operation is performed immediately after grooving; through the inclined cutting design, the situation that the edges of a silicon rod are cut preferentially when no guiding groove is adopted can be guaranteed; in the cutting process, a new line applicable to the line inlet side is adopted for cutting, so that the good cutting utility can be achieved and the lateral deviation, caused by residues, of line cutting can prevented; through the setting of the cutting speed in the front and rear segments, the cutting speed and the silicon material dropping speed can be adjusted, the higher two-way running-in and cutting efficiency can be achieved, and the problems about the lateral deviation of a silicon slice and line creases in a conventional cutting process can be effectively solved; and accordingly, the defective rate of silicon slices can be greatly reduced and the good production utility can be achieved.

Description

technical field [0001] The invention belongs to the field of silicon wafer production, and in particular relates to a polysilicon slicing method with high-efficiency scratch resistance. Background technique [0002] At present, in the field of mortar cutting polycrystalline, after the silicon material is bonded to the single crystal carrier in the bonding process, guide strips must be bonded on both sides of the silicon material surface. There will be edge curling at the entry point of the knife, and the guide strip will be cut after the cutting is completed, and the guide strip will be chopped and left in the wire cutting machine, which is not easy to clean. After the cutting starts, along with the operation of the steel wire, part of the broken guide strip is brought into the wire net during the cutting procedure, causing the steel wire to be dislocated. Since the steel wire will be positioned instantaneously during the cutting process, this will cause the thickness of the...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved is to solve the current process of cutting with guide strips. The cutting process is backward, prone to defective products, and the cutting speed is slow and the efficiency is low. Aiming at the above problems, an efficient cutting method is proposed. With its slow cutting speed and low efficiency, it provides a cutting process that does not need to use a guide bar for cutting. It adopts a double-stage cutting process, and the double-stage speed has good cutting performance, preventing thin and thick slices and wires caused by debris. In order to solve problems such as marks, etc., the rising cutting is also adopted on the entry side, the cutting effect on the entry side is good, and the slotting is accurate

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