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Integrated circuit plate drying device
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A technology for integrated circuit boards and drying devices, which is applied in drying, drying machines, heating devices, etc., and can solve the problem that integrated circuits cannot be increased or reduced at any time.
Active Publication Date: 2017-12-12
湖南日进智能科技有限公司
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Problems solved by technology
[0007] In order to overcome the shortcomings in the prior art that the integrated circuit cannot be dried in rotation, the drying force cannot be increased or decreased at any time, and the drying force cannot be moved at any time following the change of the working place, the technical problem to be solved by the present invention is to provide An integrated circuit board drying device that can dry integrated circuits in a rotating manner, can increase or decrease the drying force at any time, and can move at any time following changes in the working place
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Embodiment 1
[0035] Integrated circuit board drying device, such as Figure 1-7 As shown, it includes a bottom plate 1 , a fixing mechanism 2 and a drying mechanism 3 , the drying mechanism 3 is connected to the top left side of the bottom plate 1 , and the fixing mechanism 2 is connected to the top right side of the bottom plate 1 .
Embodiment 2
[0037] Integrated circuit board drying device, such as Figure 1-7 As shown, it includes a bottom plate 1 , a fixing mechanism 2 and a drying mechanism 3 , the drying mechanism 3 is connected to the top left side of the bottom plate 1 , and the fixing mechanism 2 is connected to the top right side of the bottom plate 1 .
[0038] The fixing mechanism 2 includes a first slide rail 201, a first stopper 202, a first slide block 203, a spring 204, a second slide rail 205, a first fixed rod 206, a second slide block 207, a clamp rod 208 and a rubber block 209, a first slide rail 201 is connected to the right side of the top of the bottom plate 1, a first slide block 203 is slidably connected to the first slide rail 201, and a first stopper 202 is connected to the middle part of the front wall of the first slide rail 201. A spring 204 is connected between the block 202 and the first slide block 203. The left side of the first slide block 203 and the lower side of the left wall of th...
Embodiment 3
[0040] Integrated circuit board drying device, such as Figure 1-7 As shown, it includes a bottom plate 1 , a fixing mechanism 2 and a drying mechanism 3 , the drying mechanism 3 is connected to the top left side of the bottom plate 1 , and the fixing mechanism 2 is connected to the top right side of the bottom plate 1 .
[0041] The fixing mechanism 2 includes a first slide rail 201, a first stopper 202, a first slide block 203, a spring 204, a second slide rail 205, a first fixed rod 206, a second slide block 207, a clamp rod 208 and a rubber block 209, a first slide rail 201 is connected to the right side of the top of the bottom plate 1, a first slide block 203 is slidably connected to the first slide rail 201, and a first stopper 202 is connected to the middle part of the front wall of the first slide rail 201. A spring 204 is connected between the block 202 and the first slide block 203. The left side of the first slide block 203 and the lower side of the left wall of th...
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Abstract
The invention relates to a drying device, in particular to an integrated circuit plate drying device. In order to solve technical problems in the prior art, the integrated circuit plate drying device which is capable of rotationally drying an integrated circuit, improving or reducing the drying intensity at any time, and moving at any time along with the change of a working place is provided. The integrated circuit plate drying device comprises a baseplate and the like, wherein a drying mechanism is connected with the left side of the top of the baseplate; and a fixing mechanism is connected with the right side of the top of the baseplate. According to the design of the integrated circuit plate drying device, rubber blocks are arranged, so that circuit components on the surface of an integrated circuit plate can be protected from damage when the integrated circuit plate is clamped; a drying lamp is arranged, so that the drying of water on the surface of the integrated circuit plate can be accelerated, and water in the components can also be dried; and accordingly, the effects that the integrated circuit plate drying device is capable of rotationally drying the integrated circuit, improving or reducing the drying intensity at any time, and moving at any time along with the change of the working place can be achieved.
Description
technical field [0001] The invention relates to a drying device, in particular to an integrated circuit board drying device. Background technique [0002] An integrated circuit board is a carrier for carrying integrated circuits. But it is often said that the integrated circuit board also brings the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. [0003] Drying refers to the process of removing the solvent to retain the solid content in some way. Usually refers to the process of passing hot air to evaporate and take away the moisture in the material. [0004] Before assembly, circuit board assembly manufacturers usually dry the PCB to prevent poor soldering due to moisture, but often ignore the moisture of components such as integrated circuits. The thermal solid material used in integrated circuit packaging seems to be moisture-proof, but the actual situation is just the opposite, so the drying of integrated ...
Claims
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Application Information
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