Packaging substrate and its electronic package and manufacturing method

Abstract

Disclosed are a package substrate and an electronic package and manufacturing method thereof. The package substrate includes an insulation protection layer, a wiring layer buried in the insulation protection layer and not penetrating the insulation protection layer, and a conductive pillar penetrating the insulation protection layer and electrically connected to the wiring layer. Therefore, the present invention Package substrate has only one wiring layer, and does not use the core layer, which can significantly reduce the thickness.

Description

technical field [0001] The invention relates to a packaging substrate, especially a packaging substrate without a core layer, an electronic packaging part and a manufacturing method thereof. Background technique [0002] With the vigorous development of the electronics industry, many high-end electronic products are gradually developing in the direction of light, thin, short, small, etc., and with the evolution of packaging technology, chip packaging technology is becoming more and more diversified. The size or volume of the semiconductor package is also continuously reduced, so as to make the semiconductor package thinner and smaller [0003] figure 1 It is a schematic cross-sectional view of a conventional flip-chip semiconductor package 1 . Such as figure 1 As shown, the semiconductor package 1 includes a package substrate 1 a and a semiconductor element 9 . [0004] The packaging substrate 1a includes: a core layer 10; a first circuit layer 12a and a second circuit l...

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Problems solved by technology

[0007] However, the conductive hole 13 needs to be mechanically drilled or laser drilled in the core layer 10 to form a through hole 100 penetrating through the core layer 10, and then copper is electroplated in the through hole 100, thus increasing the manufacturing process. the complexity of

[0008] In addition, because the existing packaging substrate 1a has a core layer 10 and at least two circuit layers, it is difficult to reduce the thickness of the packaging substrate 1a, so when the thickness of the packaging substrate 1a is difficult to reduce, the overall semiconductor package 1 The thickness is also difficult to effectively reduce

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