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A flexible circuit board and mobile terminal

A flexible circuit board and flexible circuit technology, applied in circuit thermal devices, circuit thermal components, printed circuit components, etc., can solve the problem of low vertical thermal conductivity of FPC, and achieve the effect of improving vertical thermal conductivity.

Active Publication Date: 2019-11-05
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides an FPC and a mobile terminal to solve the problem of low vertical thermal conductivity of the existing FPC

Method used

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  • A flexible circuit board and mobile terminal
  • A flexible circuit board and mobile terminal
  • A flexible circuit board and mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as Figure 1 to Figure 6 As shown, a flexible circuit board FPC includes at least one flexible circuit layer 1 .

[0025] Each flexible circuit layer 1 includes an insulating substrate 2 , a first surface 21 of the insulating substrate 2 is covered with a first conductive plate 3 , and a first circuit 4 is disposed on the first conductive plate 3 .

[0026] The first conductive plate 3 is provided with a first conduction groove 5 at a position corresponding to the first line 4 , and the first conduction groove 5 penetrates through the first conduction plate 3 in the thickness direction of the first conduction plate 3 .

[0027] The insulating substrate 2 is provided with a second conducting groove 6 at a position corresponding to the first conducting groove 5, the second conducting groove 6 communicates with the first conducting groove 5, and the second conducting groove 6 is at the thickness of the insulating substrate 2 direction through the insulating substrate...

Embodiment 2

[0050] Such as Figure 1 to Figure 6 As shown, a flexible circuit board FPC includes at least one flexible circuit layer 1 .

[0051] Each flexible circuit layer 1 includes an insulating substrate 2, the first surface 21 of the insulating substrate 2 is covered with the first conductive plate 3, the second surface 22 of the insulating substrate 2 is covered with the second conductive plate 8, the first surface of the insulating substrate 2 21 and the second surface 22 are two opposite surfaces on the insulating substrate 2 .

[0052] The first conductive plate 3 is provided with a first line 4, and the first conductive plate 3 is provided with a first conduction groove 5 at a position corresponding to the first line 4, and the first conduction groove 5 is in the thickness direction of the first conduction plate 3. The top passes through the first conductive plate 3 .

[0053] The insulating substrate 2 is provided with a second conducting groove 6 at a position corresponding...

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Abstract

The invention provides a flexible circuit board and a mobile terminal. The flexible circuit board comprises at least one flexible circuit layer. Each flexible circuit layer includes an insulated substrate; a first conductive plate covers the first surface of the insulated substrate; and a first line is arranged on the first conductive plate. A first conduction slot is formed at the position, corresponding to the first line, of the first conductive plate and penetrates the first conductive plate in a thickness direction of the first conductive plate. A second conduction slot is formed at the position, corresponding to the first conduction slot, of the insulated substrate; the second conduction slot and the first conduction slot are communicated; and the second conduction slot penetrates the insulated substrate in the thickness direction of the insulated substrate. And the first conduction slot and the second conduction slot are filled with conducting media. According to the flexible circuit board provided by the invention, the conduction slots are formed in the insulated substrate and are filled with the conducting media, so that the heat generated by the line of the flexible circuit board is transmitted rapidly and vertically by the conducting media. Therefore, the vertical heat conductivity coefficient of the flexible circuit board is increased.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to an FPC and a mobile terminal. Background technique [0002] Flexible Print Circuit (FPC for short) is a printed circuit board made of flexible copper clad laminates on a flexible insulating substrate. Because of its high wiring density, light weight or thin thickness, it is becoming more and more popular. It is more widely used in mobile terminals such as computers or mobile phones. [0003] In the existing FPC, taking the double-layer circuit as an example, an insulating substrate is arranged between the upper and lower layers of the circuit. Vias are usually designed on the insulating substrate to connect the upper and lower layers of the circuit. However, due to the limited number of via holes and the cross-sectional area of ​​the via hole Smaller, so its ability to conduct heat is less. This makes the vertical thermal conductivity of FPC very low, generally about 0.4...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0204H05K2201/06
Inventor 易小军肖石文谢长虹
Owner VIVO MOBILE COMM CO LTD
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