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Immersed type liquid cooling apparatus, blade type server and frame type server

A blade server, rack server technology, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc., can solve the problem of inconvenient maintenance of electronic components, high production costs Problems such as low heat dissipation efficiency, to achieve the effect of improving maintenance efficiency, facilitating maintenance, and improving heat dissipation efficiency

Active Publication Date: 2017-12-15
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application provides an immersion liquid cooling device to solve the problems of low heat dissipation efficiency, high production cost or operating cost, and inconvenient maintenance of electronic components in the liquid cooling system.

Method used

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  • Immersed type liquid cooling apparatus, blade type server and frame type server
  • Immersed type liquid cooling apparatus, blade type server and frame type server
  • Immersed type liquid cooling apparatus, blade type server and frame type server

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Experimental program
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Embodiment Construction

[0031] figure 1 It is a schematic diagram of a longitudinal section structure of a liquid cooling device provided in this application. like figure 1 As shown, the liquid cooling device includes a housing and an external cooling device 2 . Figure 4 Further shows the exploded structure of the shell, as Figure 4 As shown, the shell includes a hollow shell body 12 , a bottom plate 13 and a top plate 14 , the three are sealed and connected to form a closed cavity 11 , and a flow channel 6 is opened on the body of the top plate 14 .

[0032] The casing includes a closed cavity 11, and electronic components 7 to be dissipated are installed in the closed cavity 11. The first cooling liquid is filled in the airtight cavity 11 , is filled with the airtight cavity 11 , and is in direct contact with the electronic components 7 to be dissipated. exist figure 1 In the shown liquid cooling device, the flow channel 6 is not connected to the closed cavity 11 , but is connected to the ex...

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PUM

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Abstract

The invention discloses an immersed type liquid cooling apparatus, a blade type server and a frame type server. The liquid cooling apparatus comprises a housing and an external cooling device, wherein an enclosed cavity is arranged in the housing. Electronic components to be cooled are installed in the enclosed cavity, which is filled with a first liquid coolant. At least one channel is arranged in the body of the housing and the channel and the external cooling device form a loop which is filled with a second liquid coolant. The external cooling device is used to cool the second liquid coolant and provides circulation power for the second liquid coolant. The second liquid coolant discharges heat of the electronic components to be cooled conducted by the first liquid coolant through the enclosed cavity outside the housing, so as to cool the electronic components to be cooled. The problems that a liquid cooling system is low in heat radiation efficiency and high in production cost or operation cost, and the electronic components are inconvenient to maintain can be solved.

Description

technical field [0001] The present application relates to the field of cooling devices for electronic components, in particular to an immersion liquid cooling device. Background technique [0002] In electronic equipment, with the improvement of hardware integration, the power consumption of electronic components has increased significantly. The heat dissipation effect of air cooling in the past has been unable to meet the heat dissipation requirements of electronic equipment. Liquid cooling (referred to as liquid cooling) technology as a High-efficiency cooling methods have been initially applied in the IT field. [0003] Commonly used liquid cooling methods are board-level liquid cooling and immersion liquid cooling. Among them, board-level liquid cooling means that the electronic components inside the electronic device first conduct heat to the heat sink, and then contact the heat pad of the entire board through the heat sink. The thermal pad conducts heat to the upper c...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20809H05K7/203H05K7/20781
Inventor 胡航空姚希栋
Owner HUAWEI TECH CO LTD
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