Lead frame and its manufacturing process

Abstract

The invention discloses a lead frame and a manufacturing technology thereof and relates to the technical field of lead frames. The lead frame comprises toes and a positioning rack, wherein positioning holes are formed in the positioning rack; and the toes penetrate into corresponding positioning holes to be fixed by the positioning rack. The manufacturing technology comprises the following steps of first etching: carrying out half-etching on corresponding areas on a second surface of a metal substrate according to a designed circuit on the second surface of the lead frame, wherein half-etching is not etching thoroughly; glue fulling: filling the second surface of the metal substrate with insulating plastic to form the positioning rack to position the parts, which are not etched in the first etching step, on the second surface of the metal substrate; and second etching: etching the corresponding areas on the first surface of the metal substrate according to the designed circuit on a first surface of the lead frame. Seat posts and fixed posts are replaced through manufacturing the positioning rack, so that the seat posts and the fixed posts do not need to be arranged, the space is saved, limitations of the fixed posts and the seat posts to design of the toes are also eliminated, multiple rows of toes can be arranged and the circuit can be more flexibly designed.

Description

technical field [0001] The invention relates to the technical field of lead frames. Background technique [0002] Semiconductor packaging is a production process of packaging a chip (die, also known as a grain) into a chip. In this production process, the lead frame is one of the very important components that need to be used. [0003] The size of the chip is usually small, but there are many ports that need to be electrically connected to the external circuit. These ports are limited to the small size of the chip and cannot be directly connected to the external circuit. Therefore, when the chip is packaged, it is necessary to use The lead frame leads out the port that needs to be electrically connected with the external circuit, so that the chip formed after packaging can be directly electrically connected with the external circuit. [0004] Traditional lead frame structures such as figure 1 As shown, it includes a base 1 and pins 2, and the chip is bonded on the base 1, ...

AI Technical Summary

Problems solved by technology

use figure 1 After the die is packaged in the lead frame shown, it is necessary to follow the figure 1 The line a of the fixed column 4 is cut, and a whole plate is cut to form multiple single-chip chips. The knife needs to cut a large amount of metal (the lead frame is usually made of metal conductive material), and the damage is relatively large

On the other hand, the feet 2 can only be arranged in one row along the periphery of the base 1, because if you want to install multiple rows of feet 2, you must provide the feet 2 with a connecting arm connected to the fixed column 4 to fix the position, so that the inner ring The pins 2 are easily deformed and shifted, so it is impossible to install multiple rows of pins 2. Therefore, the circuit design of the lead frame with this structure is not flexible enough, and it is not suitable for the packaging of chips with a large number of ports.

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