Single-sided CSP LED and manufacturing method thereof

Abstract

The single-sided CSP LED of the present invention includes a light-emitting chip, a fluorescent glue layer, a light-transmitting glue layer, and a white glue layer. The light-emitting chip is located directly below the fluorescent glue layer. Surrounding and connected to the upper fluorescent glue layer, the white glue layer is located on the periphery of the light-transmitting glue layer, and the interface between the light-transmitting glue layer and the white glue layer forms an inclined angle with the side of the light-emitting chip. The manufacturing method of the present invention: install a fluorescent film and a square light-transmitting rubber block on the substrate; sink the light-emitting chip face down into the light-transmitting rubber block and form an inclined surface on the outside; fill white glue between the light-emitting chips and between the electrodes ; After curing, cut the white glue to get single-sided CSP LED. In the present invention, a light-transmitting adhesive layer and a peripheral white adhesive layer are arranged around the light-emitting chip to form a reflective cup structure. The white adhesive with high reflectivity forms a light-reflecting structure, which can maximize the use of light emitted from the side of the light-emitting chip and improve the light efficiency of the light source. .

Description

【Technical field】 [0001] The invention relates to the technical field of LEDs, in particular to a single-sided CSP LED and a manufacturing method thereof. 【Background technique】 [0002] The common single-sided light-emitting CSP (Chip Scale Package, light-emitting chip scale package) light source structure of the prior art, such as figure 1 As shown, it consists of a light-emitting chip 103 in the center, white glue 101 around the light-emitting chip 103, and a fluorescent layer 102 on the top; wherein, the light-emitting chip 103 is a light-emitting chip whose electrodes are located at the bottom of the light-emitting chip, so that welding wires can be omitted In the process, direct CSP solders the light source on the substrate through solder; the fluorescent layer 102 is formed by mixing transparent silica gel, fluorescent powder and auxiliary additives. The manufacturing method of the common single-sided CSP light source is to arrange the light-emitting chips on the sub...

AI Technical Summary

Problems solved by technology

The white glue 101 of the single-sided CSP light source in the prior art blocks the side light emission of the light-emitting chip 103, and the brightness of the light source is reduced; at the same time, because the white glue 101 blocks the side light emission of the light-emitting chip 103, the light is reflected and refracted multiple times. The process light is converted into heat, which greatly increases the calorific value, reduces the reliability and safety of the light source, and shortens the life of the light source

Images