Single-sided CSP LED and manufacturing method thereof

Abstract

The invention comprises a single-sided CSP LED, which comprises a light-emitting chip, a fluorescent glue layer, a light-transmitting glue layer and a white glue layer. The light-emitting chip is arranged right under the fluorescent glue layer. The light-transmitting glue layer is of a structure having a wide upper part and a narrow lower part, is adjacent to the periphery of the light-emitting chip, and is connected with the fluorescent glue layer arranged on thereon. The white glue layer is arranged on the periphery of the light-transmitting glue layer. An interface of the light-transmitting glue layer and the white glue layer forms a tilt included angle with the side surface of the light-emitting chip. The manufacturing method of the single-sided CSP LED comprises the steps of: arranging a fluorescent film and square light-transmitting glue blocks on a substrate; submerging light-emitting chips into the light-transmitting glue blocks in a face-down manner and forming inclined surfaces on the outer side; filling white glue between the light-emitting chips and between electrodes; and cutting the white glue to obtain a single-sided CSP LED after the white glue is cured. Through arranging the light-transmitting glue layer and the peripheral white glue layer to be adjacent to the periphery of the light-emitting chip, a reflection cup structure is formed, and the high-reflectivity white glue forms a reflective structure, so that the utilization of light emitted from lateral surfaces of the light-emitting chip is maximized, and the lighting efficiency of the light source is improved.

Description

【Technical field】 [0001] The invention relates to the technical field of LEDs, in particular to a single-sided CSP LED and a manufacturing method thereof. 【Background technique】 [0002] The common single-sided light-emitting CSP (Chip Scale Package, light-emitting chip scale package) light source structure of the prior art, such as figure 1 As shown, it consists of a light-emitting chip 103 in the center, white glue 101 around the light-emitting chip 103, and a fluorescent layer 102 on the top; wherein, the light-emitting chip 103 is a light-emitting chip whose electrodes are located at the bottom of the light-emitting chip, so that welding wires can be omitted In the process, direct CSP solders the light source on the substrate through solder; the fluorescent layer 102 is formed by mixing transparent silica gel, fluorescent powder and auxiliary additives. The manufacturing method of the common single-sided CSP light source is to arrange the light-emitting chips on the sub...

AI Technical Summary

Problems solved by technology

The white glue 101 of the single-sided CSP light source in the prior art blocks the side light emission of the light-emitting chip 103, and the brightness of the light source is reduced; at the same time, because the white glue 101 blocks the side light emission of the light-emitting chip 103, the light is reflected and refracted multiple times. The process light is converted into heat, which greatly increases the calorific value, reduces the reliability and safety of the light source, and shortens the life of the light source

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