Method for improving resin filling process capability

A technology of resin plugging holes and capacity, which is applied in the direction of printed circuit manufacturing, electrical connection formation of printed components, electrical components, etc., and can solve problems such as small size, ink entry, poor contact of components, etc.

Inactive Publication Date: 2017-12-22
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there should be no resin ink in the component hole that needs to be plugged in. When the distance between the via hole that needs resin plug hole and the component h

Method used

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Examples

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Example Embodiment

[0019] In order to facilitate those skilled in the art to understand the technical content of the present invention, the present invention will be further described in detail below in conjunction with embodiments.

[0020] When the present invention is specifically implemented, the steps are as follows, including:

[0021] Pre-process; electroplating, electroplating of hole copper and surface copper on the PCB board;

[0022] Paste dry film, cover both sides of the PCB board with dry film;

[0023] Then make and expose the film; in the specific operation, make a separate film, design a light blocking point on the film corresponding to the hole position of the plug hole, and the light blocking point is 4mil larger than the aperture of the plug hole on one side, and then use the film pair The dry film on the PCB board is exposed and cured. At this time, the position of the plug hole is blocked by the light blocking point, and the corresponding position on the dry film will not be expose...

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PUM

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Abstract

Disclosed is a method for improving the resin filling process capability. A new process is designed in the invention, namely, holes are covered with dry films before the holes are filled with resin, the positions of the holes needing to be filled are exposed through exposure and development, and the positions of the holes not needing to be filled are covered with the dry films. Thus, during resin filling, ink will not flow into element holes covered with dry films. The problem that the contact between elements is poor or the hole diameter is too small when the distance between a via hole filled with resin and an element hole is less than 0.8mm is solved completely.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing technology, in particular to a method for improving the manufacturing process capability of resin plug holes. Background technique [0002] Due to the rapid development of electronic information technology, the PCB size is required to be smaller and smaller, and the component pads are correspondingly smaller and smaller. In order to save space, many conductive holes are directly designed on the pads. In order to avoid affecting the soldering, it is necessary to plug such holes with resin ink and plate a layer of clad copper to make the surface of the pad flat. However, there should be no resin ink in the component hole that needs to be plugged in. When the distance between the via hole that needs resin plug hole and the component hole is less than 0.8mm, there will be a risk of ink entering the component hole, which will lead to poor contact of components or deviation of the hole diamete...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/42H05K2203/0182
Inventor 何艳球邓细辉王锋张亚锋
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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