Article manufacturing apparatus and manufacturing method

A technology for manufacturing devices and articles, applied in manufacturing tools, semiconductor/solid-state device manufacturing, molding tools, etc., can solve the problems of RFID tag damage and inapplicability, and achieve the effect of suppressing bad effects

Active Publication Date: 2018-01-02
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is not suitable for molds used at high temperature (eg, about 180°C)
The reason is that the RFID tags attached to the mold parts will be destroyed by heat

Method used

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  • Article manufacturing apparatus and manufacturing method
  • Article manufacturing apparatus and manufacturing method
  • Article manufacturing apparatus and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] based on Figure 1A , Figure 1B and Figure 2A , Figure 2B , Embodiment 1 of the manufacturing apparatus and manufacturing method of the article of the present invention will be described. A resin sealing apparatus for electronic components will be described as an example of an article manufacturing apparatus. In the resin encapsulation apparatus of electronic components, the process of covering chip-shaped elements, such as a semiconductor chip, mounted on the board|substrate (lead frame, printed circuit board, etc.) with an encapsulation resin is performed. A packaged substrate corresponding to a molded product is completed by molding an encapsulating resin on a substrate (mounted substrate) on which a chip-shaped component is mounted using a molding die. Sometimes the packaged substrate itself corresponds to an article (finished product). The individual pieces after the packaged substrate is divided (cut) may correspond to articles (finished products). In thi...

Embodiment 2

[0104] Example 2 of the manufacturing apparatus and manufacturing method of the article of the present invention will be described. In this embodiment, the second information is stored in advance in a storage device provided outside the resin sealing device 1 . As the external storage device, the following two storage devices can be mentioned. The first storage device is a storage device included in a server or the like for a user of the resin sealing device 1 to manage the semiconductor manufacturing process. The second storage device is a storage device included in a server or the like used by the qualified product provider related to the resin sealing device 1 or the molding die 6 to manage its own products, services, and the like.

[0105] In this embodiment, first, a user of the resin sealing device 1 or the molding die 6 reads the second information from a storage device included in a server or the like for managing the entire semiconductor manufacturing process. There...

Embodiment 3

[0108] according to Figure 6Embodiment 3 of the manufacturing apparatus and manufacturing method of the article of the present invention will be described. Hereinafter, as the resin encapsulating apparatus 1 of the manufacturing apparatus, a resin encapsulating apparatus 1 using a compression molding method in which one cavity CAV is provided in the lower mold 5 will be described as an example. Figure 6 The shown forming die 6 is used at high temperature (eg, about 180° C.). Therefore, it is necessary to protect the information reading unit 10 from high temperature. This embodiment shows a preferable example of the information reading unit 10 for a replaceable member used at a high temperature.

[0109] Such as Figure 6 As shown, a ball screw 30 and a nut 31 are provided on the resin encapsulation device 1 . A main conveying mechanism 32 is mounted on the nut 31 . In order to allow the main transport mechanism 32 to move in the X direction, an X direction guide rail 33...

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PUM

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Abstract

A forming mold (6) serving as an interchangeable member attached to a resin sealing device (1) is provided with a sign (9), and the sign (9) is provided with an information forming surface (9a) havinga fine pattern indicating first information including information used to specify the forming mold (6). An information reading means (10) reads the fine pattern, and a deciphering section (DE) acquires the first information on the basis of the read fine pattern. A determination section (J) makes a determination by comparing the first information with previously stored second information includinginformation used to specify the forming mold (6). On the basis of each determination result, a control section (8) controls the resin sealing device (1) such that the resin sealing device (1) operates when the forming mold (6) conforms to the second information and such that a manufacturing apparatus indicates nonconformity of the forming mold to the second information when the forming mold (6) does not conform to the second information. It is thus possible to prevent the forming mold (6) that is used in the resin sealing device (1) from being a non-conforming article.

Description

technical field [0001] The present invention relates to an article manufacturing apparatus and manufacturing method for maintaining the quality of an article and preventing adverse effects on the manufacturing apparatus by preventing incorrect installation of a replaceable member that is replaced in the manufacturing apparatus according to the article being manufactured. Background technique [0002] When replacing a die that is changed according to the type of article to be processed in a press machine, it is judged that it is a "correct die" for one of purposes of avoiding product defects. For example, a barcode label corresponding to the identification number marked on the mold installed on the main body of the punching machine is pasted on the barcode management panel installed in the machine replacement and adjustment department. When the mold is changed and adjusted, the barcode label corresponding to the identification number of the installed mold is read by the barco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/30B21D37/00B21D37/04B29C45/36B30B15/02H01L21/56
CPCB21D37/00B21D37/04B29C33/30B29C45/36B30B15/02H01L21/56B29C33/306B29C45/76H01L21/565
Inventor 松尾真高桥和宏田头史明
Owner TOWA
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