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Steel wire for silicon slice cutting

A technology of silicon wafer cutting and steel wire, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of high hardness of steel wire, wear of silicon wafers, and lower yield of silicon wafers, so as to improve yield and structure Simple, easy-to-achieve effects

Inactive Publication Date: 2018-01-09
崔敏娟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to address the above problems and provide a steel wire for cutting silicon wafers to solve the problem that the existing steel wire for cutting silicon wafers has a high hardness and is easy to cause wear to the silicon wafers during the cutting process, which reduces the yield of silicon wafers.

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  • Steel wire for silicon slice cutting

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Embodiment Construction

[0012] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the embodiments described here are only used to explain the present invention, but not to limit the present invention.

[0013] Please refer to figure 1 as shown, figure 1 It is a structural schematic diagram of a steel wire for silicon wafer cutting according to the present invention.

[0014] In this embodiment, a steel wire for cutting silicon wafers includes a steel wire body 1, the outer surface of the steel wire body 1 is provided with a soft layer 2 to avoid damage to the silicon wafer, and the soft layer 2 is made of copper material , the thickness of the soft layer 2 is 0.02mm.

[0015] It is worth mentioning that although in this embodiment, the soft layer 2 is made of copper material, the present invention is not limited thereto, and the soft layer 2 can also...

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Abstract

The invention discloses a steel wire for silicon slice cutting. The steel wire comprises a steel wire body, wherein a soft layer capable of preventing a silicon slice from being damaged is arranged onthe outer surface of the steel wire body. According to the steel wire for silicon slice cutting disclosed by the invention, the soft layer is arranged on the outer surface of the steel wire body, sothat a silicon slice can be effectively prevented from being damaged while cut, the silicon slice cutting yield is greatly increased, the structure is simple, and implementation is easy.

Description

technical field [0001] The invention relates to the field of photovoltaics, in particular to a steel wire for cutting silicon wafers. Background technique [0002] At present, silicon wafers need to go through a cutting process in the production process. The existing silicon wafers are usually cut by wire cutting. The yield rate of sheet cutting is reduced, so it needs to be solved urgently. Contents of the invention [0003] The object of the present invention is to address the above problems and provide a steel wire for cutting silicon wafers to solve the problem that the existing steel wires for cutting silicon wafers have high hardness and are prone to wear and tear on silicon wafers during the cutting process, which reduces the yield of silicon wafers. [0004] The purpose of the present invention is to realize through the following technical solutions: [0005] A steel wire for cutting silicon wafers, comprising a steel wire body, the outer surface of the steel wir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
Inventor 崔敏娟
Owner 崔敏娟