Heat sink insulation type semiconductor laser packaging structure and stack array

Abstract

The embodiment of the invention provides a heat sink insulation type semiconductor laser packaging structure and a stack array. The heat sink insulation type semiconductor laser packaging structure includes at least one semiconductor laser unit. Each semiconductor laser unit includes a first semiconductor laser module, a second semiconductor laser module, a connection electrode and a refrigerator,wherein each of the first semiconductor laser module and the second semiconductor laser module includes a laser chip and a conducting layer; the laser chip is bonded to the conducting layer and the conducting layer is arranged on the surface of the refrigerator and is in mutual insulation with the refrigerator. The electrode position of the first semiconductor laser module is opposite to that ofthe second semiconductor laser module. Electric connection between the first semiconductor laser module and the second semiconductor laser module is realized through the connection electrode. According to the invention, the semiconductor laser packaging structure is in modularized design, so that the technique is simplified, stack array assembly is facilitated and power density can be multiplied.

Description

technical field [0001] The invention relates to the field of semiconductor laser packaging, in particular to a heat sink insulation type semiconductor laser packaging structure and stacked array. Background technique [0002] At present, the packaging structure of high-power semiconductor lasers can be mainly divided into: liquid cooling type and conduction cooling type. Due to the limitation of the heat dissipation principle, the conduction cooling type is restricted in power realization, and it is difficult to realize high-power devices; the liquid cooling type packaging structure is currently the main packaging form for realizing high-power semiconductor lasers. [0003] The packaging structure of the liquid cooling type mainly includes: micro-channel liquid cooling and macro-channel liquid cooling. For microchannel liquid cooling, the bars are bonded directly to the microchannel heat sink (liquid cooler). In this packaging method, the heat sink not only needs to be use...

AI Technical Summary

Problems solved by technology

[0005] First, microchannels are prone to clogging due to narrow water channels;

[0006] Second, the microchannel heat sink itself is charged, so deionized water must be used for cooling, which has high requirements for ion concentration;

[0007] Third, the charged microchannel heat sink can easily cause electrochemical corrosion during use, destroy the microchannel structure, cause blockage, and lead to product failure;

[0008] Fourth, the overall strength and rigidity of the micro-channel heat sink is lacking, and it is easy to bend and deform during the assembly and manufacturing process, which affects the packaging quality

At the same time, this also causes the problems of poor heat dissipation and uneven temperature in the channel of the macro-channel package device, and its heat sink is also charged; this package is generally suitable for applications with low power

[0011] Therefore, the charge of the heat sink directly or indirectly limits the heat dissipation capability and packaging quality of the semiconductor laser

At present, there is an insulating type semiconductor laser packaging structure in the prior art, that is, the heat sink is insulated, but due to the complicated electrode connection structure during stack assembly, the process difficulty is increased and the power density is not high.

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