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Electronic equipment and rear shell thereof

A technology of electronic equipment and back shell, which is applied in the field of back shell and electronic equipment, can solve the problems of poor adhesion between injection molded parts and aluminum alloy stamping parts, and achieve the effect of strong adhesion

Inactive Publication Date: 2018-01-12
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Due to the smooth inner surface of the aluminum alloy stamping parts, the adhesion between the injection molded parts and the aluminum alloy stamping parts is poor, so that the two ends of the two side frames of the aluminum alloy stamping parts are easily separated from the injection molded parts

Method used

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  • Electronic equipment and rear shell thereof
  • Electronic equipment and rear shell thereof
  • Electronic equipment and rear shell thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] see Picture 1-1 , the invention provides a rear case of an electronic device, the rear case comprising:

[0044] A metal stamping part 1 and an injection molded part 2, the outer surface of the injection molded part 2 is provided with a first dispensing area, and the inner surface of the metal stamping part 1 is provided with a second dispensing area;

[0045] The second dispensing area is located in the two side area frames 11 of the metal stamping part and is provided with a rough structure 12 in the area;

[0046] The first glue dispensing area of ​​the injection molded part 2 is pasted with the second glue dispensing area of ​​the metal stamping part 1 to form the rear shell of the electronic device.

[0047] Apply glue in the second dispensing area of ​​the metal stamping part 1, apply glue in the first dispensing area of ​​the injection molded part 2, and then you can connect the first dispensing area of ​​the injection molded part 2 with the second point of the ...

Embodiment 2

[0063] see diagram 2-1 , an embodiment of the present invention provides a rear case of an electronic device, including:

[0064] The metal stamping part 1 and the injection molding part 2, the injection molding part 2 is provided with a glue dispensing area, and the inner surface of the metal stamping part 1 is pasted with the glue dispensing area of ​​the injection molding part 2;

[0065] A fixing structure 3 is provided between the inner surface of the side frame 11 of the metal stamping part 1 and the dispensing area of ​​the injection molded part 2, and the fixing structure 3 is used to fix the injection molded part 1 on the inner surface of the side frame 11 of the metal stamping part 1 .

[0066] The inner surface of the metal stamping part 1 is also provided with a glue dispensing area. Glue is applied in the glue dispensing area of ​​the metal stamping part 1, and glue is applied in the glue dispensing area of ​​the injection molded part 2, and then the glue dispen...

Embodiment 3

[0092] An embodiment of the present invention provides an electronic device, including any rear case provided in Embodiment 1 or Embodiment 2.

[0093] In the embodiment of the present invention, since the inner surface area of ​​the two side frames of the metal stamping part and the glue dispensing area of ​​the injection molded part is provided with a rough structure or the inner surface of the side frame of the metal stamping part and the glue dispensing area of ​​the injection molded part There is a fixed structure between them, so that the adhesion between the injection molded part and the metal stamped part becomes stronger, and the two ends of the two side frames of the metal stamped part are not easy to separate from the injection molded part.

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Abstract

The invention discloses electronic equipment and a rear shell thereof, which belong to the field of electronic products. The rear shell of the electronic equipment comprises a metal stamping member and injection molding members, wherein a first adhesive dispensing region is arranged on the outer surface of each injection molding member, and second adhesive dispensing regions are arranged on the inner surface of the metal stamping member; the second adhesive dispensing regions are provided with coarse structures in position regions of two side frames of the metal stamping member; and the firstadhesive dispensing regions of the injection molding members are adhered with the second adhesive dispensing regions of the metal stamping member. The electronic equipment and the rear shell thereof can increase the adhesive forces between the injection molding members and the two side frames of the metal stamping member.

Description

technical field [0001] The present application relates to the field of electronic communication, in particular to a rear case of an electronic device and the electronic device. Background technique [0002] The main body of the electronic equipment is mainly composed of electronic components. In order to protect the main body of the electronic equipment, the main body of the electronic equipment is often placed in a casing. For example, the electronic components of a mobile phone are all placed in the casing of the mobile phone. The casing of an electronic device often includes two parts, a front casing and a rear casing, and the front casing and the rear casing are combined to form a casing. [0003] There is a rear shell in the related art, which includes: an aluminum alloy stamped part and two injection molded parts, the two injection molded parts are respectively a head injection molded part and a tail injection molded part; the head injection molded part is pasted on th...

Claims

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Application Information

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IPC IPC(8): H05K5/02
Inventor 姜红光
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD