Electronic equipment and rear shell thereof
A technology of electronic equipment and back shell, which is applied in the field of back shell and electronic equipment, can solve the problems of poor adhesion between injection molded parts and aluminum alloy stamping parts, and achieve the effect of strong adhesion
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0043] see Picture 1-1 , the invention provides a rear case of an electronic device, the rear case comprising:
[0044] A metal stamping part 1 and an injection molded part 2, the outer surface of the injection molded part 2 is provided with a first dispensing area, and the inner surface of the metal stamping part 1 is provided with a second dispensing area;
[0045] The second dispensing area is located in the two side area frames 11 of the metal stamping part and is provided with a rough structure 12 in the area;
[0046] The first glue dispensing area of the injection molded part 2 is pasted with the second glue dispensing area of the metal stamping part 1 to form the rear shell of the electronic device.
[0047] Apply glue in the second dispensing area of the metal stamping part 1, apply glue in the first dispensing area of the injection molded part 2, and then you can connect the first dispensing area of the injection molded part 2 with the second point of the ...
Embodiment 2
[0063] see diagram 2-1 , an embodiment of the present invention provides a rear case of an electronic device, including:
[0064] The metal stamping part 1 and the injection molding part 2, the injection molding part 2 is provided with a glue dispensing area, and the inner surface of the metal stamping part 1 is pasted with the glue dispensing area of the injection molding part 2;
[0065] A fixing structure 3 is provided between the inner surface of the side frame 11 of the metal stamping part 1 and the dispensing area of the injection molded part 2, and the fixing structure 3 is used to fix the injection molded part 1 on the inner surface of the side frame 11 of the metal stamping part 1 .
[0066] The inner surface of the metal stamping part 1 is also provided with a glue dispensing area. Glue is applied in the glue dispensing area of the metal stamping part 1, and glue is applied in the glue dispensing area of the injection molded part 2, and then the glue dispen...
Embodiment 3
[0092] An embodiment of the present invention provides an electronic device, including any rear case provided in Embodiment 1 or Embodiment 2.
[0093] In the embodiment of the present invention, since the inner surface area of the two side frames of the metal stamping part and the glue dispensing area of the injection molded part is provided with a rough structure or the inner surface of the side frame of the metal stamping part and the glue dispensing area of the injection molded part There is a fixed structure between them, so that the adhesion between the injection molded part and the metal stamped part becomes stronger, and the two ends of the two side frames of the metal stamped part are not easy to separate from the injection molded part.
PUM
| Property | Measurement | Unit |
|---|---|---|
| Depth | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


