Variable-frequency air conditioner driver module chip cooling device and variable-frequency air conditioner

Abstract

The invention provides a variable-frequency air conditioner driver module chip cooling device and a variable-frequency air conditioner. The cooling device includes a heat conducting plate. The heat conducting plate is provided with at least one through hole penetrating the heat conducting plate along the plane where the heat conducting plate is so that a first end and a second end of the heat conducting plate form interfaces. Refrigerant pipes are connected to the interfaces in a sealing manner. In the scheme, the refrigerant directly contacts the heat conducting plate, and the problem that the cooling efficiency is decreased due to poor contact between the refrigerant pipes and the heat conducting plate in the prior art is avoided. In the prior art, the refrigerant needs to transfer heatthrough the walls of the refrigerant pipes and the heat conducting plate to cool the chip. While in the scheme, the refrigerant only needs to transfer heat through the heat conducting plate to cool the chip. The thermal contact resistance between the heat conducting plate and the refrigerant pipes is eliminated, and the efficiency of heat transfer is improved. The chip can be cooled efficiently. The cooling device can effectively cool a driver module chip under adverse conditions, such as too low voltage and too high ambient temperature, so as to ensure the output ability of the unit.

Description

technical field [0001] The present invention relates to the field of air conditioners, and more specifically, relates to a heat dissipation device for a drive module chip of an inverter air conditioner, and an inverter air conditioner having the heat dissipation device for the drive module chip of an inverter air conditioner. Background technique [0002] At present, the drive module chip of the inverter air conditioner mostly adopts the refrigerant heat dissipation method. The refrigerant heat dissipation device includes a refrigerant pipe for conveying the refrigerant and two heat conduction plates. The two heat conduction plates are set opposite to each other and the refrigerant pipe is sandwiched between them. On the surface, in order to exchange heat between the heat sink and the chip to cool down the chip, heat dissipation silicon grease is applied between the refrigerant pipe and the heat conduction plate to fill the gap between the refrigerant pipe and the heat conduc...

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Problems solved by technology

[0002] At present, the drive module chip of the inverter air conditioner mostly adopts the refrigerant heat dissipation method. The refrigerant heat dissipation device includes a refrigerant pipe for conveying the refrigerant and two heat conduction plates. The two heat conduction plates are set opposite to each other and sandwich the refrigerant pipe in the middle. On the surface, in order to exchange heat between the heat sink and the chip to cool down the chip, heat dissipation silicon grease is applied between the refrigerant pipe and the heat conduction plate to fill the gap between the refrigerant pipe and the heat conduction plate and improve the heat transfer effect. However, if the refrigerant pipe is not smooth enough or Insufficient application of heat dissipation silicone grease will lead to poor contact between the refrigerant pipe and the heat conduction plate, resulting in a significant decrease in heat dissipation efficiency. Under harsh working conditions, such as low voltage and high ambient temperature, it is easy to cause the temperature of the drive module to be too high. Limit unit capacity output

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