Terminal equipment, circuit board assembly, flashlight assembly and manufacturing method of flashlight assembly
A technology for circuit board assembly and terminal equipment, which is applied in printed circuit components, optics, instruments, etc., can solve the problems of poor heat dissipation performance, disadvantage, and inability to set flexibly, so as to improve heat dissipation efficiency, prolong service life, and improve structure. The effect of design flexibility
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Embodiment 1
[0044] Please also refer to figure 1 with figure 2 , figure 1 It is a schematic diagram of the overall structure of an embodiment of the flash unit used in the terminal equipment of the present application, figure 2 yes figure 1 Example of a side view of the flash unit. It should be noted that the terminal devices referred to in the present invention include mobile phones, tablet computers, notebook computers, and wearable devices. In this embodiment, the flash assembly includes an FPC board 110 , a flash device 120 and a heat dissipation plate 130 . FPC: flexible circuit board, the abbreviation of Flexible Printed Circuit is FPC; it is generally a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material, with wiring It has the characteristics of high density, light weight, thin thickness and good bendability.
[0045] Specifically, the flashlight device 120 is mounted on one side surface of the FPC b...
Embodiment 2
[0051] see image 3 , image 3 It is a schematic side view of the structure of another embodiment of the flashlight assembly used in terminal equipment in this application. The difference from the previous embodiment is that the heat dissipation plate 130 of the flashlight assembly in this embodiment is coated with a heat dissipation material 140 for Improve cooling efficiency. Wherein, the heat dissipation material 140 may be heat dissipation silicon grease.
[0052] see Figure 4 , Figure 4 yes image 3 A schematic front view of the structure of the flash unit in this embodiment; in this embodiment, the heat dissipation material 140 is arranged to completely cover the heat dissipation plate 130 . This arrangement structure can further improve the heat dissipation efficiency on the one hand, and on the other hand, the heat dissipation material 140 can completely cover the heat dissipation plate 130 to prevent the heat dissipation plate 130 from rusting (generally, the h...
Embodiment 3
[0055] Please also refer to Figure 5 with Image 6 , Figure 5 It is a schematic side view of another embodiment of the flash unit used in the terminal device of the present application, Image 6 yes Figure 5 The front view schematic diagram of the structure of the flash unit in the embodiment. The difference between this embodiment and the previous embodiment is that the heat dissipation material 140 covers a part of the heat dissipation plate 130, that is, the heat dissipation material 140 covers it from one side of the heat dissipation plate 130 Set up the structure.
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