Unlock instant, AI-driven research and patent intelligence for your innovation.

PoP packaging structure and packaging method

A packaging structure, chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the poor reliability of PoP packaging structure and other problems

Inactive Publication Date: 2018-01-23
VIVO MOBILE COMM CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Embodiments of the present invention provide a PoP packaging structure and a packaging method thereof to solve the problem of poor reliability of the PoP packaging structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PoP packaging structure and packaging method
  • PoP packaging structure and packaging method
  • PoP packaging structure and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0020] see figure 1 , figure 1 is a cross-sectional view of a PoP packaging structure provided by an embodiment of the present invention, such as figure 1 As shown, the PoP packaging structure provided by the embodiment of the present invention includes: a first chip 101 and a second chip 102 stacked with the first chip 101, and the first chip 101 includes a silicon substrate 1011 and a first rewiring layer (RDL) 1012, the silicon substrate 1011 has ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a PoP packaging structure and packaging method. The PoP packaging structure includes a first chip and a second chip stacked on the first chip. The first chip includes a siliconsubstrate and a first rewiring layer. The silicon substrate has a first side and a second side arranged oppositely, and has a through silicon via (TSV) penetrating the first side and the second side.The first rewiring layer is arranged on the second side, and welding balls are welded on the first rewiring layer. The second chip is arranged on the first side of the silicon substrate, and is weldedand fixed to the through silicon via (TSV). As the rewiring layer is directly arranged on the silicon substrate, poor binding force between the rewiring layer and compound is avoided. According to the embodiments of the invention, the reliability of the PoP packaging structure is improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a PoP packaging structure and a packaging method thereof. Background technique [0002] With the development of the semiconductor industry, due to the continuous demand for lower cost, higher performance, and greater integrated circuit density, package-on-package (PoP) technology has become more and more popular; especially with the rise of mobile communication equipment, on-chip The integration of system (SoC) technology and memory technology has almost become the standard configuration of high-end products. In order to further save package space, reduce package size and simplify interconnection, integrated fan-out stacked package InFO-PoP (such as bare chip + memory) has also emerged as the times require. However, under the existing InFO-PoP, the fan-out wafer package FOCSP structure is adopted. In the FOCSP structure, the edge of the product is made of a redistribution...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/31H01L23/522H01L23/528H01L21/56
CPCH01L2224/48227H01L2224/73265H01L2924/15311H01L2924/181H01L2924/00012
Inventor 李民富
Owner VIVO MOBILE COMM CO LTD