A planarization method for readout circuit
A planarization method and a technology for reading circuits, which are applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve the problems of uneven spin coatings and uneven surface structures, avoid short circuits, and solve spin coating problems. Layer unevenness, the effect of ensuring photoelectric characteristics
Active Publication Date: 2019-06-25
山西国惠光电科技有限公司
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Problems solved by technology
[0003] In order to solve the problem of uneven spin coating caused by the uneven surface structure of the readout circuit, the present invention provides a planarization method for the readout circuit
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[0025] A planarization method for a readout circuit, the method is realized by the following steps:
[0026] a. Select the readout circuit 1, and dry the readout circuit 1 after cleaning; the upper surface of the readout circuit 1 is etched with a plurality of first grooves, and the bottom of each first groove is evaporated There is a pixel electrode;
[0027] b. Deposit a silicon nitride layer 2 on the upper surface of the readout circuit 1, and ensure that the silicon nitride layer 2 covers all the first grooves; the upper surface of the deposited silicon nitride layer 2 is formed with a plurality of II grooves Groove, and each II groove corresponds to each I groove one by one;
[0028] c. Spin-coat a positive photoresist layer 3 on the upper surface of the silicon nitride layer 2, and ensure that the positive photoresist layer 3 covers all the second grooves; then, dry the positive photoresist layer 3;
[0029] d. Carry out dry etching on the upper surface of the positive...
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The invention relates to an infrared focal plane detector manufacture technology, and in particular relates to a readout circuit flattening method. According to the invention, the problem of uneven spin-coating layer caused by irregular surface structure of a readout circuit is solved. The readout circuit flattening method comprises the steps that a the readout circuit is selected; b a silicon nitride layer is deposited on the upper surface of the readout circuit; c a positive photoresist layer is spin-coated on the upper surface of the silicon nitride layer; d dry etching is carried out on the upper surface of the positive photoresist layer; e a lithography pattern is manufactured on a negative photoresist layer; f dry etching is carried out along the lithography pattern on the upper surface of the silicon nitride layer, so that each pixel electrode is exposed; g a metal layer is evaporated on the upper surface of the negative photoresist layer and the upper surface of each pixel electrode; and h the metal layer evaporated on the negative photoresist layer and the negative photoresist layer are peeled off. The readout circuit flattening method provided by the invention is suitable for manufacturing an infrared focal plane detector.
Description
technical field [0001] The invention relates to the manufacturing technology of an infrared focal plane detector, in particular to a method for flattening a readout circuit. Background technique [0002] When making an infrared focal plane detector, it is necessary to spin-coat the colloid on the readout circuit, and the obtained colloidal spin coating is very thin (only tens of nanometers), which requires the surface structure of the readout circuit to be flat and smooth . However, due to the design of multi-layer wiring and pixel electrodes, the surface structure of the readout circuit is uneven. This uneven surface structure will lead to uneven spin coating, thereby affecting the photoelectric characteristics of the infrared focal plane detector. It even leads to a short circuit of the infrared focal plane detector. Based on this, it is necessary to invent a method capable of planarizing the surface structure of the readout circuit, so as to solve the problem that the u...
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IPC IPC(8): H01L21/321
Inventor 张家鑫赛尔文·拉弗朗布瓦兹郭文姬王伟高美华
Owner 山西国惠光电科技有限公司