Assembled heat sink

Abstract

The invention relates to the field of electrical technologies, and in particular relates to an assembled heat sink. According to the assembled heat sink provided by the invention, a graphene heat dissipation film layer can accelerate the heat dissipation effect and the heat conduction performance of the heat sink; the heat transfer time between the heat sink and an electrical component is shortened; the heat dissipation effect is improved; a corrosion-resistant protective film layer is arranged to improve the corrosion resistance of the surface of the heat sink body; the graphene film layer isprotected; the graphene film layer is prevented from being damaged by physical or chemical factors, and the service life is not affected; heat dissipation through-holes are arranged, which greatly improves the heat dissipation function of the heat sink; the heat sink is detachably assembled on the heat sink body, which is easy for maintenance and replacement; and the assembled heat sink has the advantages of simple and reasonable structure, simple preparation process and low production cost.

Description

technical field [0001] The invention relates to the field of electrical technology, in particular to an assembled heat sink. Background technique [0002] The heat sink is a device used in electrical appliances to dissipate heat from electronic components that are prone to heat. The power consumption increases accordingly, and various electronic components also generate huge heat, which brings heat dissipation problems to electronic heat dissipation. With the development of high technology, electronic products are becoming increasingly intelligent and complex, the volume of electronic components tends to be miniaturized, and the density per unit area is getting higher and higher. Most of the existing heat dissipation devices have poor heat dissipation effect and poor protection performance, which leads to the problem that the graphite heat dissipation layer is easily damaged by physical or chemical factors, thereby affecting the service life of electronic components. Conte...

AI Technical Summary

Problems solved by technology

Most of the existing heat dissipation devices have poor heat dissipation effect and poor protection performance, which leads to the problem that the graphite heat dissipation layer is easily damaged by physical or chemical factors, thus affecting the service life of electronic components

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