Switch power supply integrated chip board card layout structure

Abstract

The invention discloses a switch power supply integrated chip board card layout structure. The structure comprises a printed circuit board. A front GND network is established on the front of the printed circuit board. At least five vias are arranged in the front GND network. A back GND network is laid on the back of the printed circuit board. According to the invention, the GND network is established on the front of the GND network; the GND network is added on the back of the printed circuit board; at least five vias are arranged in the front GND network; the number of vias is increased; the overcurrent capability is effectively ensured; the heat radiating area of a switch power supply integrated chip is increased; the temperature of the switch power supply integrated chip is reduced; thepower loss of the switch power supply integrated chip is reduced; energy is saved; and the power cost of a customer is reduced.

Description

technical field [0001] The invention relates to the field of switching power supply integrated chip board card layout structure, in particular to a novel switching power supply integrated chip board card layout structure. Background technique [0002] With the rapid development of Internet technology, people's demand for servers is increasing. Under the background of a large number of applications in the current information society, how to improve the efficiency of the server to save energy and reduce costs is an important development direction of server technology. [0003] The switching power supply integrated chip on the server board is a controller that integrates the control, compensation, feedback, protection and other functions of the switching power supply voltage conversion. It is widely used in various DC to DC voltage conversions. [0004] In the current layout of the switching power supply integrated chip, the heat dissipation plate is directly welded to the pri...

AI Technical Summary

Problems solved by technology

[0004] In the current layout of the switching power supply integrated chip, the heat sink is directly welded to the printed circuit board, and the contact area between the heat sink and the printed circuit board is too small, resulting in insufficient heat dissipation area. When the switching power supply performs power conversion, the heat generated cannot be dissipated in time. The temperature of the integrated chip of the switching power supply increases, which reduces the working efficiency of the integrated chip of the power supply

Images