Switch power supply integrated chip board card layout structure

A technology of integrated chip and switching power supply, which is applied in the direction of printed circuit components, etc., can solve the problems of small contact area between the heat sink and the printed circuit board, the temperature rise of the integrated chip of the switching power supply, and the reduction of the working efficiency of the integrated chip of the power supply. Effect of temperature, reduction of electricity cost, and reduction of power loss

Inactive Publication Date: 2018-01-30
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the current layout of the switching power supply integrated chip, the heat sink is directly welded to the printed circuit board, and the contact area between the heat sink and the printed circuit board is too small, resulting in insufficient heat dissipation area. When the switching power supply performs power conversion, the heat generated cannot be dissipated in time. The temperature of the integrated chip of the switching power supply increases, which reduces the working efficiency of the integrated chip of the power supply

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Switch power supply integrated chip board card layout structure
  • Switch power supply integrated chip board card layout structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be described in detail below with reference to the accompanying drawings and specific examples. The following examples are to explain the present invention, but the present invention is not limited to the following embodiments.

[0017] like figure 1 and 2 As shown, the layout structure of the switching power supply integrated chip board card provided by this embodiment includes a printed circuit board, a front GND network is established on the front of the printed circuit board, and at least five via holes 2 are set on the front GND network. Preferably, this implementation In the example, nine vias 2 are punched on the front GND network to ensure overcurrent capability. The backside GND network 3 is laid on the backside of the printed circuit board to increase the heat dissipation area of ​​the switching power supply integrated chip.

[0018] When using, solder the heat sink 1 on the front GND network, and the size of the front GND network ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a switch power supply integrated chip board card layout structure. The structure comprises a printed circuit board. A front GND network is established on the front of the printed circuit board. At least five vias are arranged in the front GND network. A back GND network is laid on the back of the printed circuit board. According to the invention, the GND network is established on the front of the GND network; the GND network is added on the back of the printed circuit board; at least five vias are arranged in the front GND network; the number of vias is increased; the overcurrent capability is effectively ensured; the heat radiating area of a switch power supply integrated chip is increased; the temperature of the switch power supply integrated chip is reduced; thepower loss of the switch power supply integrated chip is reduced; energy is saved; and the power cost of a customer is reduced.

Description

technical field [0001] The invention relates to the field of switching power supply integrated chip board card layout structure, in particular to a novel switching power supply integrated chip board card layout structure. Background technique [0002] With the rapid development of Internet technology, people's demand for servers is increasing. Under the background of a large number of applications in the current information society, how to improve the efficiency of the server to save energy and reduce costs is an important development direction of server technology. [0003] The switching power supply integrated chip on the server board is a controller that integrates the control, compensation, feedback, protection and other functions of the switching power supply voltage conversion. It is widely used in various DC to DC voltage conversions. [0004] In the current layout of the switching power supply integrated chip, the heat dissipation plate is directly welded to the pri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 于云杰
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap