Circuit board, via hole structure for circuit board, and method for realizing via hole in circuit board

Abstract

The invention provides a circuit board, a via hole structure for a circuit board, and a method for realizing a via hole in a circuit board. The circuit board and the method for realizing a via hole ina circuit board are based on the via hole structure for a circuit board. The via hole structure is applied to a circuit board having one group of signal layers for signal transmission and at least one ground layer for grounding; and all signal layers and the ground layer are laminated mutually. Besides, the via hole structure is composed of insulating dielectric layers distributed along an axialdirection of a via hole, first conductive layers for communication of different signals layers on the circuit board, and second conductive layers connected with the ground layers of the circuit board;each two of the first conductive layers, the second conductive layers and the insulating dielectric layers are parallel to each other; and the space between the first conductive layers and the secondconductive layers are filled with the insulating dielectric layers. Therefore, the operation is simplified; the design space of the via hole on the circuit board is saved; and a problem of incontinuity of impedance of the original via hole is solved.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a circuit board, a circuit board through hole structure and a method for realizing the circuit board through hole. Background technique [0002] Vias are also called metallized holes. In double-sided and multilayer circuit boards, in order to connect the printed wires between the layers, a common hole, that is, a via hole, is drilled at the intersection of the wires that need to be connected in each layer. [0003] Usually, for the case where the GND plane of the return layer is discontinuous when the high-speed differential signal line changes layers, the differential signal line layer change vias are usually added at the layer change point of the differential signal line to ensure the continuity of the system link return path. [0004] However, in the prior art, adding layer-changing vias on the differential signal line at the layer-changing place of the differential signal line is cumbers...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a circuit board, a circuit board through hole structure and a method for realizing a circuit board through hole, which are used to simplify operation, save design space, and solve the problem of the original process. Pore ​​Impedance Discontinuity Problem

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