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High thermally conductive low pressure mouldable hotmelt

A hot-melt adhesive, thermal conductivity technology, applied in non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve problems such as filler sedimentation

Inactive Publication Date: 2018-02-06
HENKEL KGAA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Materials with high viscosity may have filler settling issues

Method used

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  • High thermally conductive low pressure mouldable hotmelt

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0085] Examples E1 to E3 and Comparative Examples V1 to V4.

[0086] Different adhesive compositions were prepared, the compositions of which are shown in Table 1.

[0087] To obtain the composition, the (co)polymer and optional additives are first heated until the (co)polymer melts and then mixed until a homogeneous phase is obtained. Fillers are then added to this phase in any order. The final composition is then mixed well and allowed to cool to room temperature.

[0088] Table 1 Adhesive composition

[0089]

[0090] Polyamide 1 is Technomelt OM673 from Henkel; Spherical Alumina 1 is DAW / DAM-12 from Denka; Spherical Alumina 2 is DAW / DAM-05 from Denka; Spherical Alumina 3 is DAW / DAM-50 from Denka; Spherical alumina 4 was DAW / DAM-45 from Denka; tabular alumina was tabular alumina T60 / T64 from Almatis.

[0091] The adhesive formulations were then tested for thermal conductivity and viscosity. Measurements were obtained according to the test method described above. Vi...

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Abstract

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof. The adhesive composition of the present invention comprise at least one (co)polymer binder and at least one filler, as defined herein. The thermally conductive hotmelt adhesive composition according to the present invention is also intended to encapsulate heat generating devices such as printed circuit boards to provide better heat dissipation.

Description

technical field [0001] The present invention relates to a thermally conductive hot melt adhesive having improved thermal conductivity, its use and a method for encapsulating heat generating devices by using said thermally conductive hot melt adhesive composition. Background technique [0002] Thermally conductive adhesives are used in a variety of applications where components must be secured to a structure through, and heat must be deflected from, the components. Various applications are therefore in electronic assemblies in heat exchangers, mainly encapsulation to encapsulate heat generating devices. [0003] The materials used are challenging to integrate into electronic applications, mainly due to their poor thermal properties, excessively high viscosity or poor filler stability. Materials with excessively high viscosity are not suitable for low pressure molding, which is the preferred method of molding electronic components. Low pressure molding is preferred because i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/00C09J11/04
CPCC09J11/04C09J177/00C08K7/18C09J2400/10C09J2203/326C09J2477/00C08K3/22C08K2201/001C08K2201/016C08K2201/005C09J2301/314C09J2301/304C08L77/00C08K3/013H05K7/20481C09J2301/312B29C35/16B29C70/70B29C70/882B29K2077/00B29K2105/16B29L2031/34C08K2003/2227
Inventor D·布里尔斯G·德雷赞J·蔡C·普尔A·查普曼D·R·斯塔基
Owner HENKEL KGAA