Laser impact wave polishing device with micro grooves in contact film

A polishing device and contact film technology, applied in the field of surface treatment, can solve the problems of low efficiency and poor effect of polishing metal workpieces, and achieve the effect of ensuring consistency and surface accuracy

Active Publication Date: 2018-02-09
东台城东科技创业园管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a laser shock wave polishing device with micro-grooves on the contact film, so as to improve the shortcomings of low efficiency and poor effect in polishing metal workpieces with laser shock waves

Method used

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  • Laser impact wave polishing device with micro grooves in contact film
  • Laser impact wave polishing device with micro grooves in contact film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] In this example, the pulse width of the high-energy pulsed laser 1 is 10 ns, and the laser spot diameter is 3 mm; the confinement layer 2 is a flowing deionized water film with a thickness of about 1 mm; the material of the grooved contact film 5 is 60Si 2 CrVA spring steel with a hardness of 700HV and a thickness of 100 μm. The upper surface micro-groove width d=15 μm, the spacing D is 50 μm, the depth h=60 μm, and the roughness of the lower surface is 100 nm; the metal workpiece 8 is made of LY2 aluminum alloy, Its hardness is 130HV, the initial surface roughness is 2.04μm, and the initial surface error is 2.9μm.

[0021] By controlling the motion of the metal workpiece 8, a power density of 1.5×10 is adopted for the area of ​​20mm×20mm of the metal workpiece 8. 9 GW / cm 2 After 6 times of laser shock wave polishing with the high-energy pulsed laser 1, the measured average line roughness is 0.25 μm, and the surface shape error of the treated area measured by the inter...

Embodiment 2

[0023] In this example, the pulse width of the high-energy pulsed laser 1 is 10 ns, and the laser spot diameter is 3 mm; the confinement layer 2 is a flowing deionized water film with a thickness of about 1 mm; the material of the grooved contact film 5 is 60Si 2 CrVA spring steel with a hardness of 700HV and a thickness of 80 μm. The upper surface micro-groove width d=12 μm, the spacing D is 45 μm, the depth h=48 μm, and the roughness of the lower surface is 100 nm; the metal workpiece 8 is made of LY2 aluminum alloy, Its hardness is 130HV, the initial surface roughness is 1.78μm, and the initial surface shape error is 2.3μm.

[0024] By controlling the motion of the metal workpiece 8, a power density of 1.5×10 is adopted for the area of ​​20mm×20mm of the metal workpiece 8. 9 GW / cm 2 After 6 times of laser shock wave polishing with the high-energy pulsed laser 1, the measured average line roughness is 0.175 μm, and the surface shape error of the processed area measured by t...

Embodiment 3

[0026] In this example, the pulse width of the high-energy pulsed laser 1 is 20ns, and the laser spot diameter is 3mm; the confinement layer 2 is a flowing deionized water film, and its thickness is about 1mm; the material of the contact film 5 with grooves is 60Si 2 CrVA spring steel with a hardness of 700HV and a thickness of 50 μm. The upper surface micro-groove width d=10 μm, the spacing D is 40 μm, the depth h is 30 μm, and the roughness of the lower surface is 100 nm; the metal workpiece 8 is made of LY2 aluminum alloy, Its hardness is 130HV, the initial surface roughness is 1.12μm, and the initial surface error is 5.6μm.

[0027] By controlling the motion of the metal workpiece 8, a power density of 3.9×10 is adopted for the area of ​​20mm×20mm of the metal workpiece 8. 9 GW / cm 2 After 5 times of laser shock wave polishing with the high-energy pulsed laser 1, the measured average line roughness is 0.135 μm, and the surface shape error of the treated area measured by th...

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Abstract

The invention discloses a laser impact wave polishing device with micro grooves in a contact film. The device is characterized by structurally comprising high energy pulse laser, a restraint layer, laser waves, an absorbing layer and a rigid contact film with micro grooves. A specific process is as follows: high energy pulse laser is irradiated onto the absorbing layer through the restraint layer,and the absorbing layer quickly vaporizes to generate plasma explosion and induce high-pressure impact waves; under action of the impact waves, the rigid contact film with micro grooves grind micro bulges; the micro grooves are formed in the contact film, so that the contact film has good softness, and fits to a curved surface easier; and in a polishing process, surface roughness of a polishing area is guaranteed to be consistent; meanwhile, in the presence of the micro grooves, the bottom of the contact film can be stored to the original shape after being acted by laser impact waves, so thatsurface precision after a workpiece surface is polished during large-area polishing can be guaranteed, and the contact film can be repeatedly used. The laser impact wave polishing device can be applied to polishing treatment of a large-area free curved surface of a metal surface.

Description

technical field [0001] The invention relates to the field of surface treatment, in particular to a laser shock wave polishing device with micro-grooves on the contact film Background technique [0002] Polishing refers to the use of mechanical, chemical or electrochemical action to reduce the surface roughness of the workpiece to obtain a bright and smooth surface. Polishing cannot improve the dimensional accuracy or geometric shape accuracy of the workpiece, but aims to obtain a smooth surface or mirror luster. [0003] In the prior art, mechanical polishing can only polish the regular surface; chemical polishing and electrochemical polishing are time-consuming and inefficient; the Chinese patent "a polishing method and device based on laser shock wave 201410250823.X" proposes to control the laser shock wave The peak pressure is between the dynamic yield strength of the metal workpiece Between HEL and Hugonio limit HEL, the micro-protrusions on the surface of the metal w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00
CPCB24B1/00
Inventor 戴峰泽耿杰
Owner 东台城东科技创业园管理有限公司
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