The invention discloses a
polishing method and device based on a
laser shock wave, a structure for implementing the method comprises
high energy pulse
laser, a constraint layer, the
laser shock wave, an
absorption layer, a rigid contact film, a micro bump and a
metal workpiece. The working principle is that the
absorption layer generates
plasma explosion under the
irradiation of the
high energy pulse laser, the
plasma explosion generates a high-pressure
shock wave under the constraint action of the constraint layer, the micro bump can be taken as an uniaxial stress state under the action of the shock wave, and the surface of the
metal workpiece can be taken as an uniaxial strain state under the action of the shock wave. At the uniaxial stress state, when shock wave
peak pressure is greater than the dynamic yield strength of material, the material generates plastic deformation, at the uniaxial strain state, when the shock wave
peak pressure is greater than the HEL (Hugoniot Elastic Limit) of the material, the material generates plastic deformation; through controlling the
power density of the
high energy pulse laser, the shock wave
peak pressure is between
delta <dyn>Y and HEL of
metal, the micro bump can be ironed by the rigid contact film, and macroscopical plastic deformation is not generated on the surface of the metal, so that a
polishing effect is realized. The
polishing method and device can be applied to polishing
processing on the surface of the metal.