The invention discloses a polishing method and device based on a laser shock wave, a structure for implementing the method comprises high energy pulse laser, a constraint layer, the laser shock wave, an absorption layer, a rigid contact film, a micro bump and a metal workpiece. The working principle is that the absorption layer generates plasma explosion under the irradiation of the high energy pulse laser, the plasma explosion generates a high-pressure shock wave under the constraint action of the constraint layer, the micro bump can be taken as an uniaxial stress state under the action of the shock wave, and the surface of the metal workpiece can be taken as an uniaxial strain state under the action of the shock wave. At the uniaxial stress state, when shock wave peak pressure is greater than the dynamic yield strength of material, the material generates plastic deformation, at the uniaxial strain state, when the shock wave peak pressure is greater than the HEL (Hugoniot Elastic Limit) of the material, the material generates plastic deformation; through controlling the power density of the high energy pulse laser, the shock wave peak pressure is between delta <dyn>Y and HEL of metal, the micro bump can be ironed by the rigid contact film, and macroscopical plastic deformation is not generated on the surface of the metal, so that a polishing effect is realized. The polishing method and device can be applied to polishing processing on the surface of the metal.