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Polishing method and device based on laser shock wave

A shock wave and laser technology, applied in the field of laser shock wave-based polishing technology, can solve the problems of low efficiency, long time-consuming chemical polishing and electrochemical polishing, etc., and achieve good laser controllability, improved fatigue performance and stress corrosion resistance. Effect

Active Publication Date: 2014-09-17
江苏羿昇智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, mechanical polishing can only polish regular surfaces; chemical polishing and electrochemical polishing are time-consuming and inefficient

Method used

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  • Polishing method and device based on laser shock wave
  • Polishing method and device based on laser shock wave
  • Polishing method and device based on laser shock wave

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] In this example, the pulse width of high-energy pulsed laser 1 is 10ns, the laser spot diameter is 3mm, and the power density is 1.5×10 9 GW / cm 2 , the peak pressure generated by the high-energy pulsed laser 1 is about 900 MPa; the constrained layer 2 is a flowing deionized water film with a thickness of about 1mm; the material of the rigid contact film 5 is 60Si 2 CrVA has a thickness of 50μm, a hardness of 700HV, and a dynamic yield strength of 2.8GPa; the metal workpiece 7 is made of LY2 aluminum alloy, with a hardness of 130HV and a dynamic yield strength of 2.8GPa. It is 460MPa, the Hugong Niu limit (HEL) is about 1GPa, and the initial surface roughness is 1.62μm.

[0018] By controlling the movement of the metal workpiece 7, the 10 mm × 10 mm area of ​​the metal workpiece 7 is polished by high-energy pulsed laser 1 with a spot diameter of 3 mm for 5 laser shock wave polishing, and the measured average line roughness is 0.27 μm. The residual compressive stress o...

Embodiment 2

[0020] In this example, the pulse width of high-energy pulsed laser 1 is 20ns, the laser spot diameter is 3mm, and the power density is 1×10 9 GW / cm 2 , the peak pressure generated by the high-energy pulsed laser 1 is about 750MPa; the constrained layer 2 is a flowing deionized water film with a thickness of about 1mm; the material of the rigid contact film 5 is 60Si 2 CrVA has a thickness of 50μm, a hardness of 700HV, and a dynamic yield strength of 2.8GPa; the metal workpiece 7 is made of A304 stainless steel, with a hardness of 260HV and a dynamic yield strength of 2.8GPa. It is 580MPa, the Hugong Niu limit HEL is 800MPa, and the initial surface roughness is 2.35μm.

[0021] By controlling the movement of the metal workpiece 7, the 10 mm × 10 mm area of ​​the metal workpiece 7 is polished by high-energy pulsed laser 1 with a spot diameter of 3 mm for 5 laser shock wave polishing, and the measured average line roughness is 0.22 μm. The residual compressive stress on the s...

Embodiment 3

[0023] In this example, the pulse width of high-energy pulsed laser 1 is 20ns, the laser spot diameter is 3mm, and the power density is 4×10 9 GW / cm 2 , the peak pressure generated by the high-energy pulsed laser 1 is about 2.5GPa; the constrained layer 2 is a flowing deionized water film with a thickness of about 1mm; the material of the rigid contact film 5 is 60Si 2 CrVA has a thickness of 100μm, a hardness of 700HV, and a dynamic yield strength of 2.8GPa; the metal workpiece 3 is made of Tc4 titanium alloy, with a hardness of 330HV and a dynamic yield strength of 2.8GPa. It is 1.5GPa, the Hugong Niu limit (HEL) is about 2.8GPa, and the initial surface roughness is 1.34μm.

[0024] By controlling the movement of the metal workpiece 7, the 10 mm × 10 mm area of ​​the metal workpiece 7 is polished by high-energy pulsed laser 1 with a spot diameter of 3 mm for 5 laser shock wave polishing, and the measured average line roughness is 0.42 μm. The residual compressive stress o...

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Abstract

The invention discloses a polishing method and device based on a laser shock wave, a structure for implementing the method comprises high energy pulse laser, a constraint layer, the laser shock wave, an absorption layer, a rigid contact film, a micro bump and a metal workpiece. The working principle is that the absorption layer generates plasma explosion under the irradiation of the high energy pulse laser, the plasma explosion generates a high-pressure shock wave under the constraint action of the constraint layer, the micro bump can be taken as an uniaxial stress state under the action of the shock wave, and the surface of the metal workpiece can be taken as an uniaxial strain state under the action of the shock wave. At the uniaxial stress state, when shock wave peak pressure is greater than the dynamic yield strength of material, the material generates plastic deformation, at the uniaxial strain state, when the shock wave peak pressure is greater than the HEL (Hugoniot Elastic Limit) of the material, the material generates plastic deformation; through controlling the power density of the high energy pulse laser, the shock wave peak pressure is between delta <dyn>Y and HEL of metal, the micro bump can be ironed by the rigid contact film, and macroscopical plastic deformation is not generated on the surface of the metal, so that a polishing effect is realized. The polishing method and device can be applied to polishing processing on the surface of the metal.

Description

technical field [0001] The invention relates to the field of special processing, in particular to a polishing technology based on laser shock waves. Background technique [0002] Polishing refers to the use of mechanical, chemical or electrochemical action to reduce the surface roughness of the workpiece to obtain a bright and smooth surface. Polishing cannot improve the dimensional accuracy or geometric shape accuracy of the workpiece, but aims to obtain a smooth surface or mirror luster. [0003] In the prior art, mechanical polishing can only polish regular surfaces; chemical polishing and electrochemical polishing are time-consuming and inefficient. Contents of the invention [0004] The purpose of the present invention is to provide a new polishing method and device based on laser shock waves, so as to greatly reduce the surface roughness of metals. [0005] In order to solve the above technical problems, the concrete technical scheme that the present invention adop...

Claims

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Application Information

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IPC IPC(8): B24B1/00
CPCB24B1/00
Inventor 戴峰泽张永康
Owner 江苏羿昇智能装备有限公司
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