Infrared ultrasonic cutting mechanism of integrated circuit board and using method of infrared ultrasonic cutting mechanism

Abstract

The invention discloses an infrared ultrasonic cutting mechanism of an integrated circuit board and a using method of the infrared ultrasonic cutting mechanism. The infrared ultrasonic cutting mechanism comprises a cutting base, a placing platform and a supporting carrier, wherein an ultrasonic cutting device is arranged on the supporting carrier; a flattening device is separately arranged at eachof the left side and the right side of the upper surface of the placing platform; each flattening device consists of a stand column, a pressure block and a pressure applier; an electronic balance detecting device is arranged on the side surface of the placing platform; a plurality of concave holes are formed in the supporting carrier; and temperature and / or smoke detecting sensing devices are arranged in the concave holes. Through the flattening devices, the circuit board is pressed firmly, so that deflection in a cutting process is prevented; and meanwhile, an infrared ultrasonic cutting mode is adopted, so that phenomena of edge warping, fuzzing, wire drawing and folding of the circuit board are avoided, and therefore, the manufacturing cost is low, and the cutting effect is remarkablystrengthened.

Description

technical field [0001] The invention relates to the field of cutting integrated circuit boards, and more specifically, relates to an infrared ultrasonic cutting mechanism for integrated circuit boards and an operation method thereof. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits and plays a very important role. When producing packaged integrated circuits, it is often necessary to cut the corresponding circuit board raw materials first. During the cutting process, if the circuit board is not fixed stably, the cutting size will have a large deviation, which will cause great production waste, and currently The edge of the circuit board cut out by the advanced cutting tool is warped, fluffed, threaded, and wrinkled seriously. Such an integrated circuit board will leave a very important hidden trouble after use. Therefore, in response to this current situation, it is urgent to develop a cutting tool for circuit boards to...

AI Technical Summary

Problems solved by technology

When producing packaged integrated circuits, it is often necessary to cut the corresponding circuit board raw materials first. During the cutting process, if the circuit board is not fixed stably, the cutting size will have a large deviation, which will cause great production waste, and currently The edge of the circuit board cut out by the advanced cutting tool is warped, fluffed, threaded, and wrinkled seriously. Such an integrated circuit board will leave a very important hidden trouble after use.

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