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Cover plate of electronic equipment, preparation method of cover plate and electronic equipment

A technology for electronic equipment and cover plates, which is applied to electrical equipment shells/cabinets/drawers, electrical components, and processes for producing decorative surface effects, etc., which can solve problems such as expensive consumables, cumbersome processes, and low product yields , to achieve the effect of simple process, simple cover plate structure and improved product yield

Inactive Publication Date: 2018-02-16
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

Since this process involves the production of textured molds, the product development cycle is long and the process is complicated; in addition, consumables such as film and UV glue are expensive, which makes the process cumbersome, and the yield of the product is low and the cost is relatively high. high

Method used

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  • Cover plate of electronic equipment, preparation method of cover plate and electronic equipment
  • Cover plate of electronic equipment, preparation method of cover plate and electronic equipment
  • Cover plate of electronic equipment, preparation method of cover plate and electronic equipment

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Embodiment Construction

[0047] The following description is a preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also considered Be the protection scope of the present invention.

[0048] An embodiment of the present invention provides a method for preparing a cover plate of an electronic device, please refer to figure 2 , figure 2A flowchart of a method for preparing a cover plate of an electronic device provided by an embodiment of the present invention. The preparation method of the cover plate of the electronic equipment includes but not limited to the following steps.

[0049] Step S100, providing a substrate.

[0050] Step S200, spraying a plurality of raised structures on one side of the substrate by inkjet printing to form a textured layer to obtain a cover plate for an ele...

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Abstract

The invention provides a preparation method of a cover plate of electronic equipment. The preparation method comprises the following steps of spraying a plurality of protruding structures on the surface of one side of a substrate through ink-jet printing so as to form a texture layer; and obtaining a cover plate of the electronic equipment. Based on the preparation method, textures are printed onthe substrate through the direct ink-jet printing process, and the method is suitable for substrates of various shapes. Products can be rapidly manufactured, and the development period of products isgreatly shortened. The process is simple, and the product yield can be greatly improved. Moreover, the manufacturing cost is low. The invention further provides the cover plate of the electronic equipment and the electronic equipment.

Description

technical field [0001] The invention relates to the field of cover plate processing, in particular to a cover plate of electronic equipment, a preparation method thereof, and electronic equipment. Background technique [0002] At present, the cover texture of electronic equipment, especially mobile phones, is mainly produced by UV transfer printing. In this process, the UV glue is first printed on the mold with texture, and then the glue with texture pattern on the mold is transferred to the film, and finally the film is cut into the required shape and attached to the cover plate. The obtained cover structure is as figure 1 shown, from figure 1 It can be seen from the figure that the cover plate sequentially includes glass 100 , OCA adhesive layer 101 , PET film 102 , texture layer 103 , coating layer 104 and ink layer 105 . Since this process involves the production of textured molds, the product development cycle is long and the process is complicated; in addition, cons...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K5/03B44C1/20
CPCB44C1/20H05K5/0243H05K5/03
Inventor 杨光明
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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