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Wiring board and thermal head

A wiring substrate and thermal head technology, applied in ohmic resistance heating parts, printing, ohmic resistance electrodes, etc., can solve problems such as wiring electrode migration, and achieve the effect of inhibiting migration

Active Publication Date: 2019-09-13
AOI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to realize the miniaturization and weight reduction of the wiring board, it is important to achieve high-density wiring, but there is a problem of migration in the wiring electrodes

Method used

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  • Wiring board and thermal head
  • Wiring board and thermal head
  • Wiring board and thermal head

Examples

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Effect test

Deformed example 1

[0060] In the above-mentioned embodiment, the case where the shape of the glass layers 3 and 15 between the adjacent conductive layers 2 and 14 is a concave shape in which the glass fillets 31 are formed on the side surfaces of the conductive layers 2 and 14 is taken as an example. The description has been made, but the present invention is not limited thereto. The shape of the glass layers 3, 15 between adjacent conductive layers 2, 14 may be convex. What is necessary is just to soften and melt the glass by firing so that the glass layers 3 and 15 can be deformed and the side surfaces of the conductive layers 2 and 14 can be covered with the glass layers 3 and 15 .

Deformed example 2

[0062] In the above-mentioned embodiment, the example in which the glass layers 3 and 15 are moved up to the upper ends of the side surfaces of the conductive layers 2 and 14 has been described, but the present invention is not limited thereto. The lower parts of the side surfaces of the conductive layers 2 and 14 may be covered by the glass layers 3 and 15 while the upper parts of the side surfaces of the conductive layers 2 and 14 may not be covered by the glass layers 3 and 15 . In this way, if at least part of the side surfaces of the conductive layers 2 and 14 are covered with the glass layers 3 and 15 , migration can be suppressed compared to the case where the entire side surfaces of the conductive layers 2 and 14 are not covered with the glass layers 3 and 15 .

Deformed example 3

[0064] In the above-mentioned embodiment, the example in which the entire upper surface of the conductive layer 14 of the wire bonding portion 9 is exposed as the electrode terminal surface has been described, but the present invention is not limited thereto. When an exposed surface capable of wire bonding can be ensured, a part of the electrode terminal surface (the upper surface of the wire bonding portion 9 ) may be covered with the glass layer 15 .

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Abstract

A wiring board is provided with an insulating substrate (12), a glass layer (15) provided on the substrate (12), and a conductive layer (14) provided on the glass layer (15). At least part of the side surface of the conductive layer (14) is covered by part of the glass layer (15). At least part of the upper surface of the conductive layer (14) is exposed.

Description

technical field [0001] The present invention relates to a wiring board and a thermal head. Background technique [0002] In recent years, there has been a strong demand for miniaturization and weight reduction of wiring boards. In order to realize miniaturization and weight reduction of a wiring board, it is important to realize high-density wiring, but there is a problem of migration in wiring electrodes. It should be noted that migration (electrochemical migration) refers to a phenomenon in which metal ions are deposited on the cathode side when an electric field is applied between narrowly spaced electrodes, and the metal ions extend to the anode side in a dendritic form, causing a short circuit between conductor circuits. [0003] Conventionally, a technique for preventing a substrate defect caused by a short circuit of a wiring electrode pattern capable of suppressing migration of wiring electrodes has been proposed (see Patent Document 1). Patent Document 1 describes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/345B41J2/335H01L21/60H01L23/12H05B3/03H05K1/11
Inventor 米谷佳浩宫繁三千大
Owner AOI ELECTRONICS CO LTD