Method for controlling retaining ring planeness and produced retaining ring and semiconductor manufacturing system

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a method for controlling retaining ring planeness and a produced retaining ring and semiconductor manufacturing system. The method comprises the following steps that a basic disc face of a retaining ring is turned, and then the basic disc face is ground; and a resin face of the retaining ring is turned and is then ground. The planeness of the basic disc face of a base basically trends to be coincident before the resin face of the retaining ring is machined by increasing the step of grinding the basicdisc face of the retaining ring, and the planeness is smaller than or equal to 0.008 mm; and then the resin face is turned to enable the planeness of the turned resin face finished product to meet therequirement for the planeness of semiconductor consumable items. According to the method, the resin face grinding time is short, the using amount of grinding fluid is saved, the using number of polishing mats is saved, the production efficiency is improved, and cost is saved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for controlling the flatness of a retaining ring, a produced retaining ring, and a semiconductor manufacturing system. Background technique [0002] The efficiency of the existing flatness processing method of semiconductor consumable retainer ring is relatively low, especially for 200mm Retainer Ring (retainer ring), the general processing method is as follows: [0003] 1. Turning the back of the stainless steel to meet the size requirements of the finished product; [0004] 2. The turned PPS surface meets the size requirements of the finished product; [0005] 3. The PPS surface is polished and ground for a long time on the PPS grinder to meet the flatness requirements of semiconductor consumables. [0006] Visible, the shortcoming of related technology is: [0007] The existing method of processing and controlling the flatness of the retaining r...

AI Technical Summary

Problems solved by technology

[0007] The existing method of processing and controlling the flatness of the retaining ring first turns the stainless steel back plate surface of the retaining ring, and then turns the PPS surface of the retaining ring. It does not take into account whether the flatness of the base is consistent when processing the PPS surface, and whether it is in the Within a certain range, after turning the PPS surface, the flatness of the finished product is different, all > 0.008mm;

[0008] Grinding the PPS surface to achieve the flatness of consumables for semiconductors takes a long time, about 2 hours on average, and wastes abrasive fluid and polishing pads, resulting in high cost and low production efficiency.

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