Temperature control device in case

Abstract

The invention discloses a temperature control device in a case. The temperature control device comprises a case body, a mainboard, a driver, a heat fan, a controller and a power supply, wherein the backboard of the case body is provided with the mainboard; the mainboard is connected with the driver; the driver is connected with the right side board of the case body; the junction of the left side board of the case body and the bottom board is provided with the power supply; a position, which just faces the mainboard, on the left side board of the case body is provided with the cooling fan; a position, which is near the power supply, on the left side board of the case body is provided with the controller; the controller is lower than the cooling fan; the cooling fan is connected with a powersupply circuit after passing through the controller; and the controller comprises a metal shell, an input power line, an output power line, a fixed beam, a rotary beam, a movable conduction groove, afixed conduction block and a wax block. The design is high in cooling efficiency and high in controllability.

Description

Technical field [0001] The invention relates to a computer hardware setting, in particular to a temperature control device in a chassis, which is particularly suitable for improving heat dissipation efficiency and enhancing controllability. Background technique [0002] At present, the application range of computers (computers) in our country has become wider and wider, and the application time has become longer and longer. The heat dissipation problem has also become prominent. The key components of the computer are basically located in the case. With the operation of these components, a lot of heat will be generated. In addition to the dust accumulated in the case, if the heat is not timely, the case will easily generate high temperature. High temperature will not only reduce the operating efficiency of the components. , And it will damage the components, thereby reducing the operating life of the chassis, and even cause accidents. [0003] The Chinese patent, the authorized ann...

AI Technical Summary

Problems solved by technology

Although this design allows the chassis power supply to form an independent heat dissipation system, so that the power supply can reduce its own temperature through more cold air from the outside, but it still has the following defects: the heat dissipation of this design belongs to passive heat dissipation, not Immediate response based on temperature conditions, low heat dissipation efficiency, and weak control

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