Die ejector

Abstract

A bare core ejector includes a cylindrical case, a disc-shaped cover rotatably mounted on an upper portion of the case and having a plurality of through holes, an ejector pin inserted into a part of the through holes and used to separate a bare core from a dicing tape and a drive that moves the ejector pin vertically to separate the die from the dicing tape. In particular, the through holes are arranged in multiple rows and columns, and the centers of the through holes are separated from the center of the cover by a predetermined distance.

Description

[0001] technical background [0002] The present invention relates to a naked core outlet device. More specifically, the present invention relates to a naked core for separating a bare core from the cutting strip of the fax wafer in the bare core engagement process, wherein the bare core is bonded to such as a lead frame. And on a substrate such as a printed circuit board. [0003] Typically, the semiconductor device can be formed by the silicon wafer as a semiconductor substrate by repeating a series of preparation processes. The semiconductor device formed by the manner as described above can be cut by a cutting process and can be bonded to a substrate by a bare core adhesive process. [0004] The device for performing a bare core adhesive process can include picking up the module and the bonding module, and the pickup module is used to pick up the naked core from the bone core including a naked core through the cutting process, and the bonding module is used for Bonding the bare ...

AI Technical Summary

Problems solved by technology

However, there is a mechanical limit to reducing the pitch of the vias, and therefore it is difficult to aggressively deal with the size and shape of the die

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