[0037] Example 1
[0038] See figure 2 , In this embodiment, the substrate 1 can be along the first axis (such as Figure 4 As shown, in this embodiment, the first axis is the X axis, and the first axis direction is the X axis direction) slidably mounted in the carrier plate 2. The substrate 1 is provided with a first input microstrip line 3, a first output microstrip line 4, a second output microstrip line 5, a first branch microstrip line 6 and a second branch microstrip line 7. The first branch microstrip line The line 6 and the second branch microstrip line 7 are arranged parallel to each other, and the extension directions of the first branch microstrip line 6 and the second branch microstrip line 7 are both perpendicular to the first axis direction; the first input microstrip line 3, the first A branch microstrip line 6 and a first output microstrip line 4 are connected in sequence, and a first input microstrip line 3, a second branch microstrip line 7 and a second output microstrip line 5 are connected in sequence. In a further embodiment, the carrier plate 2 is provided with a first adjusting microstrip line, the extension direction of the first adjusting microstrip line is perpendicular to the first axis direction; the carrier plate 2 slides along the first axis direction so that the first Adjust the overlap width of the microstrip line and the first branch microstrip line 6 to be adjustable.
[0039] In this embodiment, figure 2 As shown, the first adjusting microstrip line in this structure includes at least two copper sheets 9 arranged parallel to each other, a gap is provided between the copper sheets 9 and the extending direction of the copper sheets 9 is perpendicular to the first axis direction. In a further embodiment, the substrate 1 is further provided with a third output microstrip line 10, a fourth output microstrip line 11, a third branch microstrip line 12, and a fourth branch microstrip line 13. The third branch microstrip line The line 12 and the fourth branch microstrip line 13 are arranged parallel to each other, and the extension directions of the third branch microstrip line 12 and the fourth branch microstrip line 13 are both perpendicular to the first axis direction; the first input microstrip line 3, The three-branch microstrip line 12 and the third output microstrip line 10 are connected in sequence, the first input microstrip line 3, the fourth branch microstrip line 13, and the fourth output microstrip line 11 are connected in sequence; the back of the substrate 1 is provided with copper coating Layer (not shown in the figure). The four copper sheets 9 are arranged corresponding to the four branch microstrip lines on the surface of the substrate 1.
[0040] In this embodiment, the outer wall of the carrier plate 2 is provided with a groove 14, the groove 14 penetrates the inside of the carrier plate 2, the substrate 1 is movably arranged in the groove 14, and the first regulating microstrip line 8 is arranged in the groove 14.
[0041] In a further embodiment, the base plate 1 and the carrier plate 2 are both PCB material base plates 15. The first input microstrip line 3 is arranged in the middle part of the substrate 1, and the first input microstrip line 3 receives the radio frequency current from the power supply station and shunts the current to each output microstrip line.
[0042] In this practical example, a card strip (not shown in the figure) and a plurality of concave steps 17 (such as Figure 15 As shown), the inner wall of the carrier plate 2 is provided with a chute (not shown in the figure) and a plurality of limit posts 16, and the limit posts 16 are wrapped with an insulating layer (not shown in the figure), and the clamping strip is engaged with the chute In connection, a plurality of limit posts 16 are arranged in parallel on one side of the first adjusting microstrip line 8, the limit posts 16 are arranged along the first axis direction, and the concave step 17 is arranged along the first axis direction. In actual application, the user needs to fix the substrate to the designated position of the antenna structure (not shown in the figure) through the screw structure (not shown in the figure) through the screw mounting hole, and then manually adjust the carrier plate 2 and the substrate 1 Relative position; the limit post 16 can be made of soft materials. Specifically, the snap-fit connection between the clip strip and the chute is provided to enhance the stability of the carrier plate 2 during the movement, and prevent the deviation during the horizontal movement, which may cause poor contact between the microstrip lines on the surface of the substrate 1 and the copper sheet 9 , Affect the power output and use effect. When the carrier plate 2 is moved along a straight line, the limiting column 16 moves accordingly. When the limiting column 16 moves to the concave step 17, the limiting column 16 is locked to the bottom of the concave step 17, for achieving Figure 7 The precise contact and position of the illustrated first adjusting microstrip line relative to the first branch microstrip line 6 limit the technical effect of adjustment. When the carrier plate 2 is moved by hand, the soft limit post 16 can also be removed from the concave step 17 after being deformed by force. To facilitate the removal of the limit post 16, the concave step 17 can be set to have a certain The "disk" type with inclination and concave depth is fine.
[0043] According to the content of the above-mentioned embodiment 1, this article provides the feasibility experiment of the combination structure of the above-mentioned structure and the antenna (to further explain the above-mentioned structure: in actual application, each microstrip line is also a very thin layer of copper material. The technical means are common knowledge of those skilled in the art, and the microstrip circuit on the substrate and the copper sheet on the carrier board need to be in contact with each other to realize the function of the power divider. The material of the substrate 1 is FR4, and the dielectric constant is 4.4 The material of the carrier plate 2 is also FR4 with a dielectric constant of 4.4; the working frequency range of this structure is 1.3GHZ to 1.7GHZ, and the total length of the microstrip line of the substrate 1 is about half a wavelength.
[0044] Such as image 3 As shown, the line width of the first input microstrip line 3 on the substrate 1 takes the center band 1500mhz to match the microstrip width of 50 ohms, referring to the microstrip routing formula: (microstrip)Z={87/[sqrt(Er+1.41) )]}ln[5.98H/(0.8W+T)], where W is the microstrip line width, T is the copper thickness of the trace, H is the distance from the trace to the reference plane, and Er is made of PCB material Dielectric constant. This formula must be in 0.1 <2.0 and 1 <15 can be applied. The thickness of the copper material layer is 1 OZ. Since the substrate 1 and the carrier board 2 are made of PCB materials, the thickness of the two in this embodiment is 1 mm, which is a conventional setting. According to this formula, the microstrip line width at the first input microstrip line 4 can be calculated to be 1.87 mm. Considering that the impedance of the antenna structure connected outside each output microstrip line is 25 ohms, the impedance of each branch microstrip line should be set to at least 35 ohms, based on 35= sqrt(25+50). The electrical performance of this substrate 1 is checked, and the size of the echo reflection of this substrate 1 can be examined by S11 or VSWR. The formula RL=20*log10[(VSWR+1)/(VSWR-1) shows the difference between S11 and VSWR It is only to measure the different degree of classification of values, and both represent the different numerical presentation methods of the degree of dispersion with 50 ohms. Such as Figure 5 As shown, this figure reflects the simulation experiment data after the output microstrip line of the substrate 1 is connected to the antenna radiating unit, and the impedance matching of the substrate 1 and the carrier plate 2 is detected. It can be seen that the standing wave is below 1.4, which can meet the simulation requirements . Borrow the radio frequency simulation software ADS, such as Image 6 As shown, the figure shows the phase subtraction of the first input microstrip line 3 to the first output microstrip line 4 and the phase of the first input microstrip line 3 to the second output microstrip line 5 before the carrier board 2 moves The phase difference range is within 3.5 degrees, where the maximum phase difference is 1700mhz frequency point, which is 3.5 degrees. The line width of the copper sheet 9 on the carrier board 2 is taken as the line width at the center frequency point of 1500 mhz under the condition of 35 ohm impedance.
[0045] From Figure 7 versus figure 1 In comparison, it can be seen that after the carrier board 2 moves horizontally, the first branch microstrip line 6 and the third output microstrip line 10 are arranged between the copper sheets 9, and the copper sheet 9 is connected to the first branch microstrip line 6 respectively. And the third output microstrip line 10 are in contact with each other, so that the line width of the two lines has changed, such as Figure 8 As shown, the figure reflects the impedance matching situation that occurs after the substrate 1 and the carrier plate 2 move relatively in this structure. When carrier plate 2 moves to Figure 7 When the position reaches the maximum line width, the copper sheet 9 and the first branch microstrip line 6 together form multiple current paths, which can make the current intensity at this place triple the original and increase the current intensity of the expected current path.
[0046] Since the carrier plate 2 is moving in the original state to Figure 7 Changes in state, now only examine Figure Seven The electrical indicators of the structure, the hfss software simulation results did not show a serious mismatch. With the aid of the ADS software, the amplitude and phase of the first output microstrip line 4 and the second output microstrip line 5 are investigated, such as Picture 9 As shown, the difference between the phase of the first input microstrip line 3 to the first output microstrip line 4 and the phase subtraction of the first input microstrip line 3 to the second output microstrip line 5 is a maximum of 5 degrees, compared to The carrier plate 2 did not move 3.5 degrees, only a 1.5 degree change, this change can be within the acceptable range; continue to investigate the amplitude of each port after the movement, from Picture 10 In, take the S parameter of the 1700mhz frequency band as a reference, and refer to the formula Sin=10log (P1/P2), where P1 is the output power of each output microstrip line, P2 is the total output power of the first input microstrip line 3, and LOG is the right Number 10, the amplitude ratio of the first output microstrip line 4 to the second output microstrip line 5 is 1:2.9, which is about 1:3 (the m prefix number in each amplitude detection and phase difference detection diagram is a custom number, For example: m1 and m2 are used to indicate the detection of the phase difference, m3 and m4 are used to indicate the detection of the port amplitude change value); Borrow the electromagnetic wave simulation software HFSS, when the carrier board 2 is connected to the terminal antenna before moving A pattern with a half-power beam width of 9.9 degrees, such as Picture 11 Shown. When the carrier plate 2 moves to the maximum position, such as Picture 12 As shown, the half power angle is increased to 12.4 degrees, and the pattern sidelobe is greatly improved. In summary, from Picture 11 with Picture 12 It can be seen that the antenna direction of the array has changed significantly, its side lobes have been well suppressed, and the half-power angle has also widened; due to the variable technical effect of the microstrip line width, the input port of the substrate 1 (that is, the first Input microstrip line 3) The impedance also changes accordingly, which can be used to match antennas with different load impedances.
