Electronic element high-efficiency vacuum gluing equipment

An electronic component, high-efficiency technology, applied in the manufacturing of electrical components, circuits, inductors/transformers/magnets, etc., can solve the problems of many processes, high manufacturing costs, complexity, etc., achieve good baking effect, save equipment costs, work Efficient effect

Pending Publication Date: 2018-02-27
DONGGUAN TB ELECTRONICS TECH CO LTD
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The automatic gluing machine in the prior art is generally fixed by a fixture, and the inductance is rotated through the rotating fixture to apply glue. After the gluing is completed, the glue needs to be spread evenly. It can be seen that the gluing is performed by fixing the inductance through the clamp chuck. There are too many processes, too complicated, and the equipment manufacturing cost is high

Method used

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  • Electronic element high-efficiency vacuum gluing equipment
  • Electronic element high-efficiency vacuum gluing equipment
  • Electronic element high-efficiency vacuum gluing equipment

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Embodiment Construction

[0045] The present invention will be further described below in conjunction with the accompanying drawings.

[0046] Such as Figure 1 ~ Figure 2 Shown, are respectively the three-dimensional top view of the present invention.

[0047] A high-efficiency vacuum gluing equipment 10 for electronic components, including a frame 100, a turntable mechanism 200 arranged on the frame 100, a feeding mechanism 300, a positioning mechanism 400, and a rotating mechanism arranged on the frame 100 around the turntable mechanism 200 500 and the unloading mechanism 600, the detection mechanism 700 fixed to the frame 100 above the rotating mechanism 500, the gluing mechanism 800 installed on the frame 100 above the turntable mechanism 200; the vacuum mechanism 900 and electric The control mechanism 1000 is connected with the electric control mechanism 1000 and is fixed on the control mechanism 1100 of the frame 100. The vacuum mechanism 900 is connected with the feeding mechanism 300, the bla...

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Abstract

The invention relates to the technical field of electronic component gluing, in particular to a high-efficiency vacuum gluing equipment for electronic components, including a frame, a turntable mechanism arranged on the frame, a feeding mechanism and a positioning mechanism arranged around the turntable mechanism on the frame Mechanism, rotating mechanism and feeding mechanism, the detection mechanism fixed and the frame above the rotating mechanism, the gluing mechanism installed on the frame above the turntable mechanism; the vacuum mechanism and electric control mechanism set inside the frame, and the electric control mechanism The mechanism is connected to the control mechanism fixed on the frame, the vacuum mechanism is connected with the feeding mechanism, the unloading mechanism and the turntable mechanism; the electric control mechanism is connected with the turntable mechanism, the feeding mechanism, the positioning mechanism, the rotating mechanism, the unloading mechanism, The vacuum mechanism and the control mechanism are electrically connected; the whole process of the present invention is fully automatic, and the quality of gluing on the electronic components is high, the gluing efficiency is high, and the degree of automation is high.

Description

technical field [0001] The invention relates to the technical field of electronic component gluing, in particular to a high-efficiency vacuum gluing equipment for electronic components. Background technique [0002] As the application of electronic products becomes more and more extensive, the production of various components in electronic products is becoming more and more important, and inductors, as one of the three major components, are becoming more and more important. Usually, the production of power inductors requires a copper wire winding process. After the copper wire is wound, glue needs to be applied to the position of the copper wire. This process is usually completed by an automatic glue applicator or manual glue application. [0003] The automatic gluing machine in the prior art is generally fixed by a fixture, and the inductance is rotated through the rotating fixture to apply the glue. After the gluing is completed, the glue needs to be spread evenly. It can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/00
CPCH01F41/005
Inventor 翁春雨温小金黄天碧黄文祥张健
Owner DONGGUAN TB ELECTRONICS TECH CO LTD
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